Datasheet 搜索 > 逻辑芯片 > ON Semiconductor（安森美） > MC74VHC1G14DFT1G 数据手册 > MC74VHC1G14DFT1G 产品修订记录 1/3 页
器件3D模型￥ 0.137
MC74VHC1G14DFT1G 产品修订记录 - ON Semiconductor（安森美）
制造商:
ON Semiconductor（安森美）
分类:
逻辑芯片
封装:
SC-70-5
描述:
ON SEMICONDUCTOR MC74VHC1G14DFT1G. 逻辑芯片, 转换器芯片
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
标记信息在P1
封装信息在P1
导航目录
MC74VHC1G14DFT1G数据手册
Page:
of 3 Go
若手册格式错乱，请下载阅览PDF原文件
TEM001092 Rev. E Page 1 of 3
Final Product/Process Change Notification
Document # : FPCN21043X
Issue Date: 10 September 2015
Title of Change:
Transfer of the VHC1G, VHC1GT and SZ product family devices in the SC88A package to the TS18 wafer
process at Tower Semiconductor and a change to the BOM for these same products to include Pd coated wire
and Henkel mold compound.
Proposed first ship date:
17 December 2015 or Earlier upon customer approval
Contact information:
Contact your local ON Semiconductor Sales Office or <Shero.Gao@onsemi.com>
Samples:
Contact your local ON Semiconductor Sales Office
Additional Reliability Data:
Contact your local ON Semiconductor Sales Office or <Jose.Aguilar@onsemi.com>.
Type of notification:
This is a Final Product/Process Change Notification (FPCN) sent to customers. FPCNs are issued 90 days prior
to implementation of the change.
ON Semiconductor will consider this change accepted, unless an inquiry is made in writing within 30 days of
delivery of this notice. To do so, contact <PCN.Support@onsemi.com>.
Change Part Identification:
There will be no change to standard device marking. Normal assembly lots traceability codes will identify the
new change.
Change category:
Wafer Fab Change Assembly Change Test Change Other _______________
Change Sub-Category(s):
Manufacturing Site Change/Addition
Manufacturing Process Change
Material Change
Product specific change
Datasheet/Product Doc change
Shipping/Packaging/Marking
Other: _______________________
Sites Affected:
All site(s) not applicable
ON Semiconductor site(s) :
ON Leshan, China
External Foundry/Subcon site(s)
TOWER SEMICONDUCTOR LTD
Description and Purpose:
This is a Final Process Change Notice informing ON Semiconductor customers that Logic Devices under the VHC1G, VHC1GT and SZ families in
SC88A package are now qualified to be manufactured in the TS18 wafer technology line of Tower Semiconductor Ltd and qualified to be
assembled with Pd coated Cu wire and Henkel mold compound at ON Leshan, China. These device families are currently being fabricated in the
TS60 wafer technology line of Tower Semiconductor Ltd and assembled with either Au or bare Cu wire and Nitto mold compound at ON Leshan,
China.
This FPCN will take precedence over other PCNs for the affected parts.
Tower Semiconductor Ltd, Israel fab and ON Leshan, China assembly site are certified according to ISO/TS16949 standard; and have been the
production site for majority of the Logic Devices of On Semiconductor.
Qualification tests are designed to show that the reliability of transferred devices will continue to meet or exceed ON Semiconductor standards.
ON Semiconductor recommends that customers evaluate sample units in each associated application circuit to ensure there are no unexpected
electrical incompatibilities.
Customers, that require to be sourced by automotive graded devices, have to change the ordering code to automotive part number version prior
the expiration of this PCN, which assures automotive PPAP coverage. No qualification is needed for automotive versions of the devices. In case
customer will stay with standard device, general PCN rules are applied (90 days for PCN implementation), no PPAP coverage, and no site and
change control. ON Semiconductor Customer service will provide assistance in the backlog transfer process.
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
