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MCIMX6Y2CVM08AB 其他数据使用手册 - NXP（恩智浦）
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NXP（恩智浦）
分类:
微处理器
封装:
LFBGA-289
描述:
微处理器, i.MX系列i.MX 6ULL系列, 32位, 128KB, 792MHz, 1.325V至1.5V, MAPBGA-289
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MCIMX6Y2CVM08AB数据手册
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Customer Information Notification
202104025I : NXP Final Test Site Relocation Initiative: ATTJ to ATTJ Building 2 (ATTJ-B2) - Phase 2
Note: This notice is NXP Company Proprietary.
Issue Date: Apr 20, 2021 Effective date:May 21, 2021
Here is your personalized notification about a NXP general announcement.
For detailed information we invite you to view this notification online
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[ ]Wafer Fab
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[ ]Assembly
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[ ]Product Marking
[ ]Test
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[ ]Design
[ ]Wafer Fab
Materials
[ ]Assembly
Materials
[ ]Mechanical Specification
[ ]Test
Equipment
[ ]Errata
[ ]Wafer Fab
Location
[ ]Assembly
Location
[ ]Packing/Shipping/Labeling
[X]Test
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[ ]Electrical
spec./Test
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[ ]Firmware
[ ]Other
PCN Overview
Description
NXP Semiconductors announces the ATTJ Final Test Site Relocation Initiative from the current NXP ATTJ, Tianjin,
China test site to local, nearby (2.5km away) ATTJ-B2 test site, creating a consolidated ATTJ Test Center of
Excellence. The associated Test Backend Shipping / Packing Operations relocate to the ATTJ-B2 site as well.
This NXP Initiative is a phased / ramped relocation activity, until all Final Test platform types have been relocated to
the ATTJ-B2.
This major, strategic NXP initiative ensures future scalability of NXP ATTJ backend manufacturing sites, ATTJ main
factory and new ATTJ-B2, to support current and future business. The current ATTJ main factory manufacturing
floor space is fully utilized. Final Test and Test Backend Shipping / Packing Operations must be migrated to the new
ATTJ-B2 Test Center of Excellence, while the existing ATTJ main factory will be exclusive for assembly and other
non-Final Test operations. This initiative allows growth opportunities for both ATTJ manufacturing buildings for
customer supply assurance.
The ATTJ-B2 is located 2.5 km Southeast from the current ATTJ main factory site, and adheres to the same ATTJ
criteria: 100k clean room rating, temperature / humidity / ESD controls, and quality accreditations.
All current ATTJ main factory Final Test equipment (hardware / software), test flows, test programs, policies,
procedures, and personnel will be relocated to the new ATTJ-B2. Absolutely no impact to product form, fit, function
or reliability.
Please see the attached documents for additional details, including Qualification Results.
Reason
Qualification of NXP ATTJ, Tianjin, China new ATTJ-B2 is a new NXP strategic initiative to create a consolidated
ATTJ Test Center of Excellence for Final Test Site and associated Test Backend Shipping / Packing Operations for
current and future customer supply assurance.
Identification of Affected Products
Product identification does not change
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