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MCP1825S-2502E/EB 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
稳压芯片
封装:
TO-263-4
描述:
500毫安，低电压，低静态电流LDO稳压器 500 mA, Low Voltage, Low Quiescent Current LDO Regulator
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P3
导航目录
MCP1825S-2502E/EB数据手册
Page:
of 6 Go
若手册格式错乱，请下载阅览PDF原文件
Product Change Notification - KSRA-05ATCO683
Date:
11 Mar 2019
Product Category:
Linear Regulators; Others
Affected CPNs:
Notification subject:
CCB 3454 and 3454.001 Initial Notice: Qualification of GTBF as a new assembly site for selected
products of 0.8um XFAB, 0.8um AMS and 0.6um AMI, 130K and 133K wafer technologies available
in 3L and 5L DDPAK packages with MSL 3 classification.
Notification text:
PCN Status:
Initial notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls)
Description of Change:
Qualification of GTBF as a new assembly site for selected products of 0.8um XFAB, 0.8um AMS and
0.6um AMI, 130K and 133K wafer technologies available in 3L and 5L DDPAK packages.
Pre Change:
Assembled at CARSEM using 84-1 LMISR4 die attach, CEL-9240HF10 molding compound and
HCL-12S leadframe material with MSL 1 classification
Post Change:
Assembled at GTBF using CRM-1800 die attach, EME-G600 molding compound and LY80
leadframe material with MSL 3 classification
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Carsem (M) SDN BHD
(CARM)
Great Team Backend Foundry
(Dong Guan) Ltd. (GTBF)
Wire material Au wire Au wire
Die attach material 84-1 LMISR4 CRM-1800
Molding compound
material
CEL-9240HF10 EME-G600
Lead frame material HCL-12S LY80
MSL Classification
MSL 1 MSL 3
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve on-time delivery performance by qualifying GTBF as a new assembly site. CARM
assembly site will no longer have manufacturing support for the selected products.
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