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MCP2003A-E/MD 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
接口芯片
封装:
DFN-8
描述:
MCP2003/2004 LIN 收发器### LIN 通信 - Microchip
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P9Hot
典型应用电路图在P7
原理图在P2
标记信息在P20
封装信息在P20P21P22P23P25P26P31
技术参数、封装参数在P1P4P11P13P14P15P16P18
应用领域在P7
电气规格在P13P14P15
导航目录
MCP2003A-E/MD数据手册
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若手册格式错乱，请下载阅览PDF原文件
2010-2014 Microchip Technology Inc. DS20002230F-page 1
MCP2003/4/3A/4A
Features:
• The MCP2003/2003A and MCP2004/2004A are
compliant with Local Interconnect Network (LIN)
Bus Specifications 1.3, 2.0 and 2.1 and are
compliant to SAE J2602
• Support Baud Rates up to 20 kbaudwith
LIN-Compatible Output Driver
• 43V Load Dump Protected
• Very Low High Electromagnetic Immunity (EMI)
meets Stringent Original Equipment Manufactur-
ers (OEM) Requirements
• Very High Electrostatic Discharge (ESD)
Immunity:
->20kV on V
BB (IEC 61000-4-2)
->14kV on LBUS (IEC 61000-4-2)
• Very High Immunity to RF Disturbances meets
Stringent OEM Requirements
• Wide Supply Voltage, 6.0V-27.0V Continuous
• Extended Temperature Range: -40 to +125°C
• Interface to PIC
®
MCU EUSART and Standard
USARTs
• LIN Bus Pin:
- Internal pull-up resistor and diode
- Protected against battery shorts
- Protected against loss of ground
- High current drive
• Automatic Thermal Shutdown
• Low-Power mode:
- Receiver monitoring bus and transmitter off,
(
5µA)
Description:
This device provides a bidirectional, half-duplex
communication, physical interface to automotive and
industrial LIN systems to meet the LIN Bus
Specification Revision 2.1 and SAE J2602. The device
is short-circuit and over-temperature protected by
internal circuitry. The device has been specifically
designed to operate in the automotive operating
environment and will survive all specified transient
conditions while meeting all of the stringent quiescent
current requirements.
MCP200X family members:
• 8-pin PDIP, DFN and SOIC packages:
- MCP2003, LIN-compatible driver, with WAKE
pins, wake-up on falling edge of L
BUS
- MCP2003A, LIN-compatible driver, with
WAKE
pins, wake-up on rising edge of LBUS
- MCP2004, LIN-compatible driver, with
FAULT
/TXE pins, wake-up on falling edge of
L
BUS
- MCP2004A, LIN-compatible driver, with
FAULT
/TXE pins, wake-up on rising edge of
L
BUS
Package Types
MCP2004/2004A
PDIP, SOIC
FAULT/TXE
CS/WAKE
T
XD
VBB
LBUS
1
2
3
4
8
7
6
5
VSS
VRENRXD
MCP2003/2003A
PDIP, SOIC
WAKE
CS
T
XD
VBB
LBUS
1
2
3
4
8
7
6
5
VSS
VRENRXD
MCP2003/2003A
4x4 DFN*
WAKE
CS
T
XD
VBB
LBUS
1
2
3
4
8
7
6
5
VSS
VRENRXD
EP
9
MCP2004/2004A
4x4 DFN*
FAULT/TXE
CS/WAKE
TXD
VBB
LBUS
1
2
3
4
8
7
6
5
VSS
VRENRXD
EP
9
* Includes Exposed Thermal Pad (EP); see Table 1-2.
LIN J2602 Transceiver
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