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MCP2003BT-E/MF 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
LIN芯片
封装:
DFN-8
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P7Hot
典型应用电路图在P6
原理图在P2
标记信息在P17
封装信息在P17P19P20P21P22P23P24P29
技术参数、封装参数在P1P4P10P11P12P13P14P16
应用领域在P6
电气规格在P10P11P12P13
导航目录
MCP2003BT-E/MF数据手册
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若手册格式错乱，请下载阅览PDF原文件
2015-2016 Microchip Technology Inc. DS20005463C-page 1
MCP2003B
Features
• The MCP2003B is Compliant with Local
Interconnect Network (LIN) Bus Specifications
1.3, 2.0, 2.1, 2.2, SAE J2602, and ISO17987
• Supports Baud Rates up to 20 Kbaudwith
LIN-Compatible Output Driver
• 60V Load Dump Protected
• Very High Electromagnetic Immunity (EMI) Meets
Stringent Original Equipment Manufacturers
(OEM) Requirements
• Direct Capacitor Coupling Robustness without
Transient Voltage Suppressor (TVS):
- ±35V on L
BUS (SAE J2962-1)
- ±85V on LBUS (SAE J2962-1)
• High Electrostatic Discharge (ESD)
Immunity without TVS:
->25kV on L
BUS (SAE J2962-1)
->15kV on VBB (IEC 61000-4-2)
- >6 kV on LBUS (IEC 61000-4-2)
• Very High Immunity to RF Disturbances Meets
Stringent OEM Requirements
• Wide Supply Voltage: 5.5V – 30.0V Continuous
• Extended (E) Temperature Range: -40°C to +125°C
• High (H) Temperature Range: -40°C to +150°C
• Interfaces to PIC
®
MCU EUSART and Standard
USARTs
• LIN Bus Pin:
- Internal pull-up resistor and diode
- Protected against battery shorts
- Protected against loss of ground
- High current drive: >40 mA
• Automatic Thermal Shutdown
• Low-Power Mode:
- Receiver monitoring bus and transmitter off:
(
5µA)
Description
This device provides a bidirectional, half-duplex
communication, physical interface to automotive and
industrial LIN systems to meet the LIN Bus
Specification Revision 2.2, SAE J2602, and ISO
17987. The device is both short-circuit and
overtemperature protected by internal circuitry. The
device has been specifically designed to operate in the
automotive operating environment and will survive all
specified transient conditions while meeting all of the
stringent quiescent current requirements.
Package Types
MCP2003B
SOIC
MCP2003B
2x3 DFN*
* Includes Exposed Thermal Pad (EP); see Table 1-2.
WAKE
CS
T
XD
V
BB
L
BUS
1
2
3
4
8
7
6
5
V
SS
V
REN
RXD
EP
9
WAKE
CS
T
XD
V
BB
L
BUS
1
2
3
4
8
7
6
5
V
SS
V
REN
RXD
EP
9
MCP2003B
3x3 DFN*
WAKE
CS
T
XD
V
BB
L
BUS
1
2
3
4
8
7
6
5
V
SS
V
REN
RXD
LIN Transceiver
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