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MCP2150-I/P 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
接口芯片
封装:
DIP-18
描述:
Microchip### 信号转换
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MCP2150-I/P数据手册
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若手册格式错乱，请下载阅览PDF原文件
Product Change Notification - JAON-07XOUF239
Date:
13 Apr 2020
Product Category:
Others; 8-bit Microcontrollers; Touch Controllers; 16-Bit - Microcontrollers and Digital Signal
Controllers; 32-bit Microcontrollers; Interface- Controller Area Network (CAN); Interface- Infrared
Products; Interface- LCD Drivers; Interface- LIN Transceiver; Interface- Passive-Keyless-Entry
Analog Front End; Interface- Serial Peripherals; Ionization Smoke Detector Front Ends; Binary and
BCD A/D Converters; Display A/D Converters; Linear Comparators; Linear Op Amps; Linear
Programmable Gain Amplifiers; Photoelectric Smoke Detector; Digital Potentiometers; Dual Slope
A/D Converters; Frequency-to-Voltage / Voltage-to-Frequency Converters; Successive
Approximation Register (SAR) A/D Converters; System D/A Converters; Piezoelectric Horn Drivers;
Charge Pump DC-to-DC Converters; Hot Swap Controller; Linear Regulators; Power MOSFET
Drivers; Switching Regulators; Brushless DC Fan Controllers & Fan Fault Detectors; Temperature
Sensors; Memory; Real-Time Clock/Calendar; Wireless IC; KEELOQ® Decoder Devices; KEELOQ®
Encoder Devices; KEELOQ® Transcoder Devices; USB Bridge; Ethernet Controllers; Driver /
Interface ICs; Power Management - PMIC; Power Management - Power Switches; Power
Management - PWM Controllers; Power Management - System Supervisors/Voltage Detectors;
AC/DC - Switchmode PWM Controllers; Simple and Complex Programmable Logic
Affected CPNs:
Notification subject:
CCB 4202 Final Notice: Qualification of G600V as an additional/alternative mold compound material
for selected products available in 8L, 14L, 16L, 18L, 20L, 28L, 40L PDIP and 28L SPDIP packages
at MMT assembly site using gold (Au) wire.
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of G600V as an additional/alternative mold compound material for selected products
available in 8L, 14L, 16L, 18L, 20L, 28L, 40L PDIP and 28L SPDIP packages at MMT assembly site
using gold (Au) wire.
Pre Change:
Using GE800 mold compound material.
Post Change:
Using GE800 mold compound material or using G600V mold compound material.
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand (Branch)
(MMT)
Microchip Technology Thailand
(Branch)
(MMT)
Wire material
Gold (Au) Gold (Au)
Die attach material
CRM-1064L CRM-1064L
Molding compound material
GE800 GE800 G600V
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