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MCP2562T-E/MF 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
CAN芯片
封装:
DFN-8
描述:
半-收发器-1-1-CANbus-8-DFN（3x3）
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P4Hot
典型应用电路图在P6
原理图在P2
标记信息在P17
封装信息在P17P18P19P20P22P23P27
技术参数、封装参数在P15P16
应用领域在P1P6
电气规格在P7P9P10P11P13
导航目录
MCP2562T-E/MF数据手册
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若手册格式错乱，请下载阅览PDF原文件
2013-2014 Microchip Technology Inc. DS20005167C-page 1
MCP2561/2
Features:
• Supports 1 Mb/s Operation
• Implements ISO-11898-2 and ISO-11898-5
Standard Physical Layer Requirements
• Very Low Standby Current (5 µA, typical)
•VIO Supply Pin to Interface Directly to
CAN Controllers and Microcontrollers with
1.8V to 5.5V I/O
• SPLIT Output Pin to Stabilize Common Mode in
Biased Split Termination Schemes
• CAN Bus Pins are Disconnected when Device is
Unpowered:
- An Unpowered Node or Brown-Out Event will
Not Load the CAN Bus
• Detection of Ground Fault:
- Permanent Dominant Detection on TXD
- Permanent Dominant Detection on Bus
• Power-on Reset and Voltage Brown-Out
Protection on V
DD Pin
• Protection Against Damage Due to Short-Circuit
Conditions (Positive or Negative Battery Voltage)
• Protection Against High-Voltage Transients in
Automotive Environments
• Automatic Thermal Shutdown Protection
• Suitable for 12V and 24V Systems
• Meets or exceeds stringent automotive design
requirements including “Hardware Requirements
for LIN, CAN and FlexRay Interfaces in Automo
-
tive Applications”, Version 1.3, May 2012
• High-Noise Immunity Due to Differential Bus
Implementation
• High Electrostatic Discharge (ESD) Protection on
CANH and CANL, meeting the IEC61000-4-2 up
to ±14
kV
• Available in PDIP-8L, SOIC-8L and 3x3 DFN-8L
• Temperature ranges:
- Extended (E): -40°C to +125°C
- High (H): -40°C to +150°C
Description:
The MCP2561/2 is a Microchip Technology Inc. second
generation high-speed CAN transceiver. It serves as an
interface between a CAN protocol controller and the
physical two-wire CAN bus.
The device meets the automotive requirements for
high-speed (up to 1
Mb/s), low quiescent current,
electromagnetic compatibility (EMC) and electrostatic
discharge (ESD).
Package Types
MCP2562
PDIP, SOIC
VDD
VSS
RXD
CANH
CANL
1
2
3
4
8
7
6
5
VIO
STBYTXD
MCP2561
PDIP, SOIC
VDD
VSS
RXD
CANH
CANL
1
2
3
4
8
7
6
5
SPLIT
STBYT
XD
MCP2561
3x3 DFN*
VDD
VSS
RXD
CANH
CANL
1
2
3
4
8
7
6
5
SPLIT
STBYT
XD
EP
9
MCP2562
3x3 DFN*
VDD
VSS
RXD
CANH
CANL
1
2
3
4
8
7
6
5
VIO
STBYTXD
EP
9
* Includes Exposed Thermal Pad (EP); see Table 1-2.
MCP2561/2 Family Members
Device Feature Description
MCP2561 Split pin Common mode stabilization
MCP2562 VIO pin Internal level shifter on digital I/O pins
Note: For ordering information, see the “Product Identification System” section on page 27.
High-Speed CAN Transceiver
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