Datasheet 搜索 > AD转换器 > Microchip（微芯） > MCP3301-CI/SN 数据手册 > MCP3301-CI/SN 产品修订记录 2/40 页
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MCP3301-CI/SN 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
AD转换器
封装:
SOIC-8
描述:
MICROCHIP MCP3301-CI/SN 模数转换器, AEC-Q100, 13 bit, 100 kSPS, 单, 4.5 V, 5.5 V, SOIC
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型号编号列表在P4
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MCP3301-CI/SN数据手册
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8390A die attach and palladium coated copper wire with gold flash (CuPdAu) bond wire material assembled at MMT
assembly site.
Pre Change:
Using lead frame without lead lock
Post Change:
Using lead frame with lead lock
Pre and Post Change Summary:
Pre Change
Post Change
Assembly Site
Microchip Technology
Thailand (Branch) / MMT
Microchip Technology Thailand
(Branch) / MMT
Wire material
CuPdAu
CuPdAu
Die attach material
8390A
8390A
Molding compound material
G600V
G600V
Lead frame material
CDA194
CDA194
Lead Frame Lead Lock
No
Yes
See attached pre and post change comparison
Impacts to Data Sheet: None
Change Impact:None
Reason for Change:To improve productivity by qualifying new lead frame design.
Change Implementation Status:In Progress
Estimated Qualification Completion Date:March 2021
Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions
however implementation will not occur until after qualification has completed and a final PCN has been issued. The final
PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date
guided in the final PCN customers may receive pre and post change parts.
Time Table Summary:
February 2021
March 2021
Workweek
06
07
08
09
10
11
12
13
14
Initial PCN Issue Date
X
Qual Report
Availability
X
Final PCN Issue Date
X
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