Datasheet 搜索 > AD转换器 > Microchip（微芯） > MCP3422A1T-E/MC 数据手册 > MCP3422A1T-E/MC 产品修订记录 2/11 页
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MCP3422A1T-E/MC 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
AD转换器
封装:
DFN-8
描述:
18位，多通道I ??我英镑的模拟数字转换器与I2Câ ?? ¢接口和板载参考 18-Bit, Multi-Channel ÎΣ Analog-to-Digital Converter with I2C⢠Interface and On-Board Reference
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型号编号列表在P4
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MCP3422A1T-E/MC数据手册
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of 11 Go
若手册格式错乱，请下载阅览PDF原文件
Post Change:
Assembled at NSEB using gold (Au) bond wire or palladium coated copper with gold flash (CuPdAu) bond wire, 8600 die
attach material, EFTEC-64T lead frame or C194 lead frame material, Ag DAP surface prep or Bare Cu DAP surface prep and
without lead lock lead frame
orAssembled at MMT using palladium coated copper with gold flash (CuPdAu) bond wire, 3280 die attach material, C194
lead frame material, Bare Cu DAP surface prep and with lead lock lead frame.
Pre and Post Change Summary:
Pre Change
Post Change
Assembly Site
UTAC Thai Limited (UTL-1) LTD.
NSEB
UTAC Thai Limited (UTL-1) LTD.
NSEB
Microchip Technology
Thailand (Branch)/MMT
Wire material
Au
CuPdAu
Au
CuPdAu
CuPdAu
Die attach material
8600
8600
3280
Molding compound
material
G700LTD
G700LTD
G700LTD
Lead frame material
EFTEC-64T
C194
EFTEC-64T
C194
C194
Lead Frame DAP Surface
Prep
Ag
Bare Cu
Ag
Bare Cu
Bare Cu
Lead frame lead-lock
No
No
Yes
See Pre and Post Change attachment for lead frame comparison.
Impacts to Data Sheet: None
Change Impact:None
Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.
Change Implementation Status:In Progress
Estimated First Ship Date February 10, 2021 (date code: 2108)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Time Table Summary:
January
2021
February 2021
Workweek
01
02
03
04
05
06
07
08
09
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