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MCP3422A6T-E/MS 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
AD转换器
封装:
MSOP-8
描述:
18位，多通道I ??我英镑的模拟数字转换器与I2Câ ?? ¢接口和板载参考 18-Bit, Multi-Channel ÎΣ Analog-to-Digital Converter with I2C⢠Interface and On-Board Reference
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MCP3422A6T-E/MS数据手册
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PRODUCTS APPLICATIONS DESIGN SUPPORT TRAINING SAMPLE AND BUY ABOUT
US CONTACT US myMicrochip Login
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Date:
29 Jun 2016
Product Category:
Memory; Analog (Thermal, Power Management & Safety); Analog (Linear & Mixed Signal) AND
Interface; 8-bit Microcontrollers
Notification subject:
CCB 2594 Final Notice: Qualification of CuPdAu bond wire in selected products of the 150K and
160K wafer technologies available in 8L MSOP package at MTAI assembly site.
Notification text:
PCN Status:
Final notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 150K and
160K wafer technologies available in 8L MSOP package at MTAI assembly site.
Pre Change:
Gold (Au) bond wire
Post Change:
Palladium coated copper with gold flash (CuPdAu) bond wire
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site MTAI assembly site MTAI assembly site
Wire material Au wire CuPdAu wire
Die attach material 8390A 8390A
Molding compound material G600 G600
Lead frame material CDA194 CDA194
Impacts to Data Sheet:
None
Reason for Change:
To improve manufacturability and qualify Palladium coated copper with gold flash (CuPdAu) bond wire.
Change Implementation Status:
In Progress
Estimated First Ship Date:
July 24, 2016 (date code: 1629)
Product Change Notification - JAON-15OELO113
Page 1 of 2Product Change Notification - JAON-15OELO113 - 29 Jun 2016 - CCB 2594 Final Notic...
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