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MCP4151T-104E/MS 其他数据使用手册 - Microchip(微芯)
制造商:
Microchip(微芯)
分类:
数字电位器
封装:
MSOP-8
描述:
7/8位单/双SPI数字电位器具有易失性存储器 7/8-Bit Single/Dual SPI Digital POT with Volatile Memory
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P4P5P6P7P8P9P10P11P12P13P14P15
导航目录
MCP4151T-104E/MS数据手册
Page:
of 21 Go
若手册格式错乱,请下载阅览PDF原文件

Date:
28 Nov 2017
Product Category:
Real-Time Clock/Calendar; Temperature Sensors; 8-bit PIC Microcontrollers; Memory; Power
Management - PWM Controllers; Sigma - Delta A/D Converters; Digital Potentiometers; System D/A
Converters; Linear Op Amps; Instrumentation Amplifier
Notification subject:
CCB 3178 Initial Notice: Qualification of MMT as an additional assembly site for selected products of
the 150K and 160K wafer technologies available in 8L MSOP package using CuPdAu bond wire.
Notification text:
PCN Status:
Initial notification.
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of MMT as an additional assembly site for selected products of the 150K and 160K wafer
technologies available in 8L MSOP package using palladium coated copper with gold flash (CuPdAu)
bond wire.
Pre Change:
Assembled at MTAI assembly site.
Post Change:
Assembled at MTAI or MMT assembly site.
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip
Technology Thailand
- HQ
(MTAI)
Microchip
Technology
Thailand - HQ
(MTAI)
Microchip
Technology Thailand
– Branch (MMT)
Wire material
CuPdAu CuPdAu CuPdAu
Die attach material
8390A 8390A 8390A
Molding compound
material
G600V G600V G600V
Lead frame material
CDA194 CDA194 CDA194
Product Change Notification - GBNG-07TJKP903
Page 1 of 3Product Change Notification - GBN
G
-07TJKP903 - 28 Nov 2017 - CCB 3178 Initial Not
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http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=GBN
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-07TJKP
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