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MCP4162T-503E/MS 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
数字电位器
封装:
MSOP-8
描述:
7/8位单/双SPI数字电位器具有非易失性存储器 7/8-Bit Single/Dual SPI Digital POT with Non-Volatile Memory
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MCP4162T-503E/MS数据手册
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若手册格式错乱，请下载阅览PDF原文件
Date:
04 Dec 2017
Product Category:
Temperature Sensors
Notification subject:
CCB 3174 Initial Notice: Qualification of CuPdAu bond wire in selected products of the 200K wafer
technology available in 8L TDFN (2x3x0.8mm) package at NSEB assembly site
Notification text:
PCN Status:
Initial notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products for
200K wafer technology available in 8L TDFN (2x3x0.8mm) package at NSEB assembly site
Pre Change:
Using gold (Au) bond wire, 8200T die attach, and G770HCD molding compound material
Post Change:
Using palladium coated copper with gold flash (CuPdAu) bond wire, 8600 die attach, and G700LTD
molding compound material
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
UTAC Thai Limited LTD.
(NSEB)
UTAC Thai Limited LTD.
(NSEB)
Wire material Au Wire CuPdAu Wire
Die attach material 8200T 8600
Molding compound
material
G770HCD G700LTD
Lead frame material C194 C194
Product Change Notification - KSRA-22MRJA026
Page 1 of 3Product Change Notification - KSR
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http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=KSR
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