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MCP42010T-I/SL 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
数字电位器
封装:
SOIC-14
描述:
256阶 8位 SPI 10kOhm 非易失性数字电位器 表面贴装-SOIC-14
Pictures:
3D模型
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MCP42010T-I/SL数据手册
Page:
of 7 Go
若手册格式错乱，请下载阅览PDF原文件
Date:
05 Jun 2017
Product Category:
Linear Op Amps; Interface- Passive-Keyless-Entry Analog Front End; Touch Controllers; Interface-
Infrared Products; Interface- Controller Area Network (CAN); Successive Approximation Register
(SAR) A/D Converters; Digital Potentiometers; Linear Comparators; Linear Selectable Gain
Amplifiers; Linear Programmable Gain Amplifiers; 8-bit PIC Microcontrollers
Notification subject:
CCB 2852: Final Notice: Qualification of CuPdAu bond wire for selected products of 120K wafer
technology available in 14L SOIC package at MMT assembly site using 95x155 mils lead frame
paddle size
Notification text:
PCN Status:
Final notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products of 120K wafer
technology available in 14L SOIC package at MMT assembly site using 95x155 mils lead frame paddle size
Pre Change:
Assembled at MMT using gold (Au) bond wire, 90X110 mils lead frame paddle size, spot LF plating and
assembled in MTAI using Palladium coated copper (PdCu) bond wire, 95X155 mils lead frame paddle size, and
Bare Cu LF surface
Post Change:
Assembled in MMT using palladium coated copper with gold flash (CuPdAu) bond wire, 95X155 mils lead frame
paddle size, and Bare Cu LF surface
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site MMT MTAI MMT
Wire material Au Wire PdCu Wire CuPdAu Wire
Die attach material 8390A 8390A 8390A
Molding compound material G600V G600V G600V
Lead frame material C194 C194 C194
Lead Frame Paddle Size 90x110 mils 95x155 mils 95x155 mils
LF Surface Spot Bare Cu Bare Cu
Impacts to Data Sheet:
None
Change Impact:
None
Product Change Notification - KSRA-02RRCB401
Page 1 of 3Product Change Notification - KSR
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-02RRCB401 - 05 Jun 2017 - CCB 2852: Final Not
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http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=KSR
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-02RRCB40...
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