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Date:
05 Aug 2017
Product Category:
Memory; Power Management - PWM Controllers; Sigma - Delta A/D Converters; Digital
Potentiometers; System D/A Converters; Instrumentation Amplifier; Battery Management and
Fuel Gauges - Battery Chargers; Temperature Sensors; 8-bit PIC Microcontrollers
Notification subject:
CCB 3041 Initial Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond in
selected products of the 160K wafer technology available in 8L DFN package at NSEB assembly
site
Notification text:
PCN Status:
Initial notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond in selected products of the 160K wafer
technology available in 8L DFN package at NSEB assembly site
Pre Change:
Using gold (Au) bond wire, 8200T or 8600 die attach material, G770HCD or G700LTD molding compound material
and C194 or EFTEC-64T lead frame material
Post Change:
Using palladium coated copper with gold flash (CuPdAu) bond wire 8600 die attach material, G700LTD molding
compound material and C194 lead frame material
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site NSEB Assembly Site NSEB Assembly Site
Wire material Au Wire CuPdAu Wire
Die attach material 8200T 8600 8600 8600
Molding compound material G770HCD G700LTD G700LTD G700LTD
Lead frame material C194 C194 EFTEC-64T C194
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve manufacturability by qualifying CuPdAu bond wire at NSEB assembly site.
Change Implementation Status:
In Progress
Estimated Qualification Completion Date:
January 2018
Product Change Notification - KSRA-20OSOQ751
Page 1 of 2Product Change Notification - KSR
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