Datasheet 搜索 > DA转换器 > Microchip（微芯） > MCP4911T-E/MC 数据手册 > MCP4911T-E/MC 产品修订记录 1/11 页
器件3D模型￥ 10.092
MCP4911T-E/MC 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
DA转换器
封装:
DFN-8
描述:
8月10日/ 12-位电压输出数位类比转换器，SPI接口 8/10/12-Bit Voltage Output Digital-to-Analog Converter with SPI Interface
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P4
导航目录
MCP4911T-E/MC数据手册
Page:
of 11 Go
若手册格式错乱，请下载阅览PDF原文件
Page 1 of 3
Product Change Notification / LIAL-21DKJL279
Date:
27-Jan-2021
Product Category:
8-bit Microcontrollers, Analog to Digital Converters, Battery Management and Fuel Gauges - Battery
Chargers, Digital Potentiometers, Digital to Analog Converters, Instrumentation Amplifier, Memory,
Power Management - PWM Controllers, Temperature Sensors
PCN Type:
Manufacturing Change
Notification Subject:
CCB 4439.001 and 4439.002 Final Notice: Qualification of MMT as an additional assembly site for
selected products available 8L DFN (3x3x0.9mm) and (2x3x0.9mm) packages.
Affected CPNs:
LIAL-21DKJL279_Affected_CPN_01272021.pdf
LIAL-21DKJL279_Affected_CPN_01272021.csv
Notification Text:
PCN Status:Final notification.
PCN Type: Manufacturing Change
Microchip Parts Affected:Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change: Qualification of MMT as an additional assembly site for selected products available 8L DFN
(3x3x0.9mm and 2x3x0.9mm) packages.
Pre Change:
Assembled at NSEB using gold (Au) bond wire or palladium coated copper with gold flash (CuPdAu) bond wire, 8600 die
attach material, EFTEC-64T lead frame or C194 lead frame material, Ag DAP surface prep or Bare Cu DAP surface prep and
without lead lock lead frame
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
