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MCP6041T-E/MS 其他数据使用手册 - Microchip（微芯）
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Microchip（微芯）
分类:
运算放大器
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MSOP-8
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MCP6041T-E/MS数据手册
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PRODUCTS APPLICATIONS DESIGN SUPPORT TRAINING SAMPLE AND BUY ABOUT
US CONTACT US myMicrochip Login
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Date:
29 Jul 2016
Product Category:
Analog (Linear & Mixed Signal) AND Interface
Notification subject:
CCB 2593 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond
wire in selected products of the 120K wafer technology available in 8L MSOP package at MTAI
assembly site.
Notification text:
PCN Status:
Final notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of
the 120K wafer technology available in 8L MSOP package at MTAI assembly site.
Pre Change:
Gold (Au) bond wire
Post Change:
Palladium coated copper with gold flash (CuPdAu) bond wire
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site MTAI assembly site MTAI assembly site
Wire material Au wire CuPdAu wire
Die attach material 8390A 8390A
Molding compound
material
G600 G600
Lead frame material CDA194 CDA194
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve productivity and qualifying Palladium coated copper with gold flash (CuPdAu) bond wire.
Change Implementation Status:
In Progress
Product Change Notification - JAON-15VCCB774
Page 1 of 3Product Change Notification - JAON-15VCCB774 - 29 Jul 2016 - CCB 2593 Final Notic...
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http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=JAON-15VCCB77
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