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MCP6042-I/SN 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
运算放大器
封装:
SOIC-8
描述:
MICROCHIP MCP6042-I/SN 运算放大器, 双路, AEC-Q100, 14 kHz, 2个放大器, 0.003 V/µs, 1.4V 至 5.5V, SOIC, 8 引脚
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型号编号列表在P4
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MCP6042-I/SN数据手册
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of 33 Go
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Page 1 of 3
Product Change Notification / JAON-04DXFD964
Date:
22-Mar-2021
Product Category:
8-bit Microcontrollers, Analog to Digital Converters, Capacitive Touch Sensors, Charge Pump DC-to-DC
Converters, Digital Potentiometers, Digital to Analog Converters, Instrumentation Amplifier, Interface-
Controller Area Network (CAN), Interface- Infrared Products, Interface- LIN Transceiver, KEELOQ®
Encoder Devices, Linear Comparators, Linear Op Amps, Linear Programmable Gain Amplifiers, Memory,
Piezoelectric Horn Drivers and CO Detector, Power Management - PWM Controllers, Power MOSFET
Drivers, Real-Time Clock/Calendar, RFID tag ICs - microID® ICs, Temperature Sensors
PCN Type:
Manufacturing Change
Notification Subject:
CCB 4541 Final Notice: Qualification of a new lead frame design for selected products available in 8L
SOIC package using 8390A die attach and gold (Au) bond wire material assembled at MMT assembly
site.
Affected CPNs:
JAON-04DXFD964_Affected_CPN_03222021.pdf
JAON-04DXFD964_Affected_CPN_03222021.csv
Notification Text:
PCN Status: Final notification
PCN Type: Manufacturing Change
Microchip Parts Affected:Please open one of the files found in the Affected CPNs section.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:Qualification of a new lead frame design for selected products available in 8L SOIC package using
8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.
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