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MCP6546-I/SN 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
比较器
封装:
SOIC-8
描述:
Microchip### 比较器，Microchip
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MCP6546-I/SN数据手册
Page:
of 34 Go
若手册格式错乱，请下载阅览PDF原文件
Date:
12 Apr 2017
Product Category:
Memory; Power MOSFET Drivers; Interface- Infrared Products; Sigma - Delta A/D Converters;
Digital Potentiometers; System D/A Converters; Linear Op Amps; Linear Comparators;
Instrumentation Amplifier; Linear Programmable Gain Amplifiers; Capacitive Touch Sensors; 8-bit
PIC Microcontrollers; Temperature Sensors
Notification subject:
CCB 1835 Final Notice: Qualification of CuPdAu bond wire in selected products of the 40K, 42K,
77K, 120K, 150K, 160K and 200K wafer technologies available in 8L SOIC package at MMT
assembly site.
Notification text:
PCN Status:
Final notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 40K, 42K,
77K, 120K, 150K, 160K and 200K wafer technologies available in 8L SOIC package at MMT assembly site.
Pre Change:
Gold (Au) or Palladium coated copper wire (PdCu) bond wire
Post Change:
Palladium coated copper with gold flash (CuPdAu) bond wire
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site MMT assembly site MMT assembly site
Wire material Au wire or PdCu wire CuPdAu wire
Die attach material 8390A 8390A
Molding compound material G600V G600V
Lead frame material CDA194 CDA194
Product Change Notification - JAON-08BVJU876
Page 1 of 3Product Change Notification - JAON-08BVJU876 - 12 Apr 2017 - CCB 1835 Final Notic...
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http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=JAON-08BVJU8
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