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MM74HC244WM 其他数据使用手册 - ON Semiconductor（安森美）
制造商:
ON Semiconductor（安森美）
分类:
逻辑控制器
封装:
SOIC-20
描述:
MM74HC系列 CMOS 八 三态 非反相 缓冲器 - SOIC-20
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MM74HC244WM数据手册
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TEM001793 Rev. O Page 1 of 8
Final Product/Process Change Notification
Document # : FPCN22178X
Issue Date: 2 April 2018
Title of Change:
Migration of HC/HCT/VHC/VHCT/LVX Legacy Fairchild Products to ON Semiconductor qualified BOM and
manufacturing site.
Proposed first ship date:
10 July 2018
Contact information:
Contact your local ON Semiconductor Sales Office or <Steven.Zhong@onsemi.com>
Samples:
Contact your local ON Semiconductor Sales Office
Additional Reliability Data:
Contact your local ON Semiconductor Sales Office or <ChangKit.Mok@onsemi.com >
Type of notification:
This is a Final Product/Process Change Notification (FPCN) sent to customers. FPCNs are issued 90 days prior to
implementation of the change.
ON Semiconductor will consider this change accepted, unless an inquiry is made in writing within 30 days of
delivery of this notice. To do so, contact <PCN.Support@onsemi.com>.
Change Part Identification:
Affected products will be identified with ON logo and ON standard Trace code.
Change category:
☒ Wafer Fab Change ☒ Assembly Change ☒ Test Change ☐ Other _________
Change Sub-Category(s):
☒ Manufacturing Site Change/Addition
☐ Manufacturing Process Change
☒ Material Change
☐ Product specific change
☐ Datasheet/Product Doc change
☐ Shipping/Packaging/Marking
☐ Other: _______________________
Sites Affected:
ON Semiconductor Sites:
ON Carmona, Philippines
ON Maine, US
External Foundry/Subcon Sites:
Subcon, Japan
Subcon, Thailand
Subcon, Taiwan
Subcon, Philippines
Subcon, Israel
Subcon, China
Description and Purpose:
This Final Notification announces to the customers the change of HC/HCT/VHC/VHCT/LVX Legacy Fairchild Products fab, assembly & test to existing
qualified BOM and SITES as listed in table below.
Before 90 day PCN expires
Between PCN expires and Jan 1st 2019
After Jan 1st 2019
Fab
Site
Subcon China
ON S. Portland Maine
Subcon China
ON S. Portland Maine
Subcon Israel
Subcon Israel
Package
Assemb
ly Site
Subcon
Philippines
Subcon
Thailand
Subcon
Taiwan
Subcon
Philippines
Subcon
Thailand
Subcon
Taiwan
ON
Semiconduct
or,
Philippines
Subcon
China
ON
Semiconduct
or,
Philippines
Subcon
China
TSSOP-
14
Leadfra
me
Pre plated
leadframe
(NiPdAu)
Not applicable
Not
applicable
Pre plated
leadframe
(NiPdAu)
Not applicable
Not
applicable
Pre plated
leadframe
(NiPdAu)
Copper with
Ag plated
Pre plated
leadframe
(NiPdAu)
Copper with
Ag plated
Die
attach
QMI519
(Henkel)
QMI519
(Henkel)
CRM-
1076WB
(Sumitomo)
EN-4900
CRM-
1076WB
(Sumitomo)
EN-4900
Wire
Au wire
Au wire
Copper wire
Copper wire
Copper wire
Copper wire
Lead
finish
NiPdAu
NiPdAu
NiPdAu
Sn
NiPdAu
Sn
Compou
nd
CEL800JF
(Hitachi)
CEL800JF
(Hitachi)
EME G600
or EME 700
(Sumitomo)
G700
EME G600
or EME 700
(Sumitomo)
G700
TSSOP-
16
Leadfra
me
Pre plated
leadframe
(NiPdAu)
Not applicable
Not
applicable
Pre plated
leadframe
(NiPdAu)
Not applicable
Not
applicable
Pre plated
leadframe
(NiPdAu)
Copper with
Ag plated
Pre plated
leadframe
(NiPdAu)
Copper with
Ag plated
Die
attach
QMI519
(Henkel)
QMI519
(Henkel)
CRM-
1076WB
(Sumitomo)
EN-4900
CRM-
1076WB
(Sumitomo)
EN-4900
Wire
Au wire
Au wire
Copper wire
Copper wire
Copper wire
Copper wire
Lead
finish
NiPdAu
NiPdAu
NiPdAu
Sn
NiPdAu
Sn
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