Datasheet 搜索 > 微处理器 > NXP（恩智浦） > MPC8360VVAGDGA 数据手册 > MPC8360VVAGDGA 产品修订记录 1/2 页
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MPC8360VVAGDGA 产品修订记录 - NXP（恩智浦）
制造商:
NXP（恩智浦）
分类:
微处理器
封装:
BGA-740
描述:
NXP MPC8360VVAGDGA 芯片, 微控制器, 32位, POWER, 400MHZ, TBGA-740
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MPC8360VVAGDGA数据手册
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Customer Information Notification
201904018I
Issue Date: 20-Jun-2019
Effective Date: 20-Jul-2019
Dear Gordon Love,
Here's your personalized quality information
concerning products Premier Farnell PLC purchased
from NXP.
For detailed information we invite you to view this
notification online
This notice is NXP Company Proprietary.
Change Category
[ ] Wafer Fab Process
[ ] Assembly
Process
[X] Product Marking
[ ] Test
Location
[ ] Design
[ ] Wafer Fab Materials
[ ] Assembly
Materials
[ ] Mechanical Specification
[ ]Test
Process
[ ] Errata
[ ] Wafer Fab Location
[ ] Assembly
Location
[ ]
Packing/Shipping/Labeling
[ ] Test
Equipment
[ ] Electrical
spec./Test
coverage
[ ] Firmware
[ ] Other
Removal of Test Site
Marking from Trace
Code
Description
NXP Semiconductors announces the standardization of trace code marking for the devices associated with
this notification. The test site character will be removed from the product part marking for those parts that
currently include it. Part traceability is not affected by this change. Customers will continue to receive both
trace code markings until inventory is depleted.
After WW29 (20Jul'19) customers can expect to see either trace code markings.
Corresponding ZVEI Delta Qualification Matrix ID: SEM-PA-13
Reason
NXP is standardizing the trace code marking.
Identification of Affected Products
Top side marking
See attached file with examples of new marking.
Anticipated Impact on Form, Fit, Function, Reliability or Quality
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