Datasheet 搜索 > 微控制器 > TI（德州仪器） > MSP430F1612IRTDT 数据手册 > MSP430F1612IRTDT 其他数据使用手册 1/5 页
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MSP430F1612IRTDT 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
微控制器
封装:
VQFN-64
描述:
混合信号微控制器 MIXED SIGNAL MICROCONTROLLER
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
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技术参数、封装参数在P3
导航目录
MSP430F1612IRTDT数据手册
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Texas Instruments, Inc. PCN# 20141208000A
PCN Number:
20141208000A
PCN Date:
02/06/2015
Title:
Assembly site move from Amkor K1 to Amkor P1 for Select Devices
Customer Contact:
PCN Manager
Phone:
+1(214)480-6037
Dept:
Quality Services
Proposed 1
st
Ship Date:
03/16/2015
Estimated Sample
Availability:
Date provided at
sample request
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Revision A is to update the description of change to provide correction on the included BOM
comparison table below as follows. We apologize for any inconvenience this may have caused.
Group 1:
- No material difference for Mount Compound between Amkor K1 and Amkor P1
- Mold compound part no. updated
- Remove Au wire option for Amkor P1
Group 2: No material difference between Amkor K1 and Amkor P1
Assembly site move from Amkor K1 to Amkor P1 for Select Devices. Material differences are as
follows:
Group 1 Device
Amkor K1
Amkor P1
Mount Compound
101361223
4208458
Mold Compound
101319571
4211649 101377289
Wire type
Au
Au, Cu
Lead Finish
Matte Sn
NiPdAu
Group 2 Device
Amkor K1
Amkor P1
Mount Compound
101361223
4208458
Mold Compound
101319571
4211649
Reason for Change:
Closure of the Amkor K1 assembly facility. Continuity of supply.
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None.
Changes to product identification resulting from this PCN:
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