Datasheet 搜索 > 微控制器 > TI（德州仪器） > MSP430F6733IPN 数据手册 > MSP430F6733IPN 产品修订记录 1/6 页
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MSP430F6733IPN 产品修订记录 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
微控制器
封装:
LQFP-80
描述:
混合信号微控制器 MIXED SIGNAL MICROCONTROLLER
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MSP430F6733IPN数据手册
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Texas Instruments, Inc. PCN# 20140917001
PCN Number:
20140917001
PCN Date:
09/19/2014
Title:
BSL Firmware change and the addition of TSMC-F10 (Fab 10) as a Wafer Fab site
option for select devices
Customer Contact:
PCN Manager
Phone:
+1(214)480-6037
Dept:
Quality Services
Proposed 1
st
Ship Date:
12/19/2014
Estimated Sample
Availability:
Date provided at
sample request.
Change Type:
Assembly Site
Assembly Process
Assembly Materials
Design
Electrical Specification
Mechanical Specification
Test Site
Packing/Shipping/Labeling
Test Process
Wafer Bump Site
Wafer Bump Material
Wafer Bump Process
Wafer Fab Site
Wafer Fab Materials
Wafer Fab Process
Part number change
PCN Details
Description of Change:
This change notification is to announce a BSL Firmware change and the addition of TSMC-F10 (Fab
10) as an additional Wafer Fab site option for the products listed in the product affected section of
this document.
Current Wafer Fab Site
Process
Wafer Diameter
TSMC-WF3 (Fab 3)
0.18 Embedded Flash
200mm
TSMC-WFT (Fab 11)
0.18 Embedded Flash
200mm
Additional Fab Site
Process
Wafer Diameter
TSMC-F10 (Fab 10)
0.18 Embedded Flash
200mm
BSL Firmware Change:
Description of Change
Benefit of Change
Errata BSL 6
Errata BSL 7
Errata USB 11
Reduced errata
Reason for Change:
Continuity of Supply
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None
Changes to product identification resulting from this PCN:
Current
Chip Site
Chip site code (20L)
Chip country code (21L)
TSMC-WF3 (Fab 3)
TS5
TWN
TSMC-WFT (Fab 11)
T13
USA
New
Chip Site
Chip site code (20L)
Chip country code (21L)
TSMC-F10 (Fab 10)
TSS
CHN
Die Rev designator will change as listed in the device grouping and sample label below.
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