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MT29F8G08ABACAWP-IT:C TR 其他数据使用手册 - Micron（镁光）
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Micron（镁光）
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Flash芯片
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TSOP-48
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MT29F8G08ABACAWP-IT:C TR数据手册
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Note: Per JEDEC Standard JESD46-C Section 3.2.3; lack of acknowledgment of this PCN within 30 days constitutes acceptance of change
1 of 1 Micron Confidential and Proprietary Information
Micron Technology, Inc.
8000 S. Federal Way
PO Box 6
Boise, ID United States
83707-0006
Product Change Notice
Micron PCN: 31652
Date: 08/07/2015
Type of Change:
Manufacturing Site – Change or Addition
Title of Change:
Additional Fabrication and Assembly sites supporting 25nm NAND SLC Flash
Description of Change:
Micron Fab 6 (Manassas Virginia, USA) will be added as an additional fabrication
site for production of 2/4/8Gb (M79M/M70M/M71M) NAND components. Micron
Muar Malaysia will be added as an additional assembly site for production of
2/4/8Gb VFBGA and 2/4/8Gb TSOP single die NAND (SDP) packages. Customers
should be ready to receive product from the new sites from the production ship date
below.
Product/Data Schedule:
Micron Fab 6
Micron Muar, TSOP
Micron Muar, VFGBA
Qual Data Available:
2/4Gb: May 2015
Fab 2: July 2015
Fab 2: June 2015
8Gb: Aug 2015
Fab 6: Sept 2015
Fab 6: Sept 2015
Reason for Change:
Additional Source/Supplier, Supply Flexibility/Security
Contact Information:
Marketing Contact
SATHYANATH SUBRAMANIAN
Micron Semiconductor Prds
SATHYANATHSU@MICRON.COM
Engineering Contact
PEILING ZHANG
Micron Semiconductor Prds
PZHANG@MICRON.COM
Product Affected:
25nm NAND SLC Flash Memory
2/4/8Gb NAND components
Single Die Packages VFBGA and TSOP (2/4Gb)
Affected Micron Part Number
MT29F8G08ABACAH4:C
MT29F8G16ABBCAH4-IT:C
MT29F16G08ADBCAH4:C
MT29F8G08ABACAH4-S:C
MT29F8G08ABBCAH4:C
MT29F16G08ADBCAH4-IT:C
MT29F8G08ABACAWP-IT:C
MT29F8G08ABBCAH4-IT:C
MT29F2G08ABAFAH4-IT:F
MT29F8G08ABACAH4ES:C
MT29F8G16ABACAH4:C
MT29F2G08ABBFAH4-IT:F
MT29F4G16ABAEAH4:E
MT29F8G16ABACAH4-IT:C
MT29F2G08ABAFAWP:F
MT29F2G16ABBFAH4:F
MT29F2G16ABBFAH4-IT:F
MT29F2G16ABAFAWP:F
MT29F8G08ABACAH4-ITS:C
MT29F16G16ADACAH4:C
MT29F2G08ABBFAH4:F
MT29F8G08ABACAH4-IT:C
MT29F16G16ADACAH4-IT:C
MT29F2G08ABAFAH4-S:F
MT29F8G08ABACAWP:C
MT29F16G16ADBCAH4:C
MT29F2G08ABAFAH4-ITS:F
MT29F8G16ABACAWP:C
MT29F16G16ADBCAH4-IT:C
MT29F2G08ABAFAWP-IT:F
MT29F8G16ABACAWP-IT:C
MT29F16G08ADACAH4:C
MT29F2G08ABAFAH4:F
MT29F8G16ABBCAH4:C
MT29F16G08ADACAH4-IT:C
Method of Identification:
Micron's inner packing container label will indicate country of origin and fabrication
site. Refer to Micron Customer Service Note CSN-11: Product Marks/Product and
Packaging Labels.
Micron Sites Affected:
Fab 6 – US
MMY – Muar_Malaysia
Product/Data Schedule
New/Changed Product:
Sample Availability:
Product Ship Date:
07/30/2015
11/07/2015
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