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NCP1607BDR2G 产品修订记录 - ON Semiconductor（安森美）

制造商:

ON Semiconductor（安森美）

分类:

电源管理

封装:

SOIC-8

描述:

ON SEMICONDUCTOR NCP1607BDR2G PFC CTRL, BOOST, -0.3V TO 20V, SOIC-8 新

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NCP1607BDR2G数据手册

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Final Product/Process Change Notification

Document #:FPCN22741X1

Issue Date:25 Feb 2020

NOTE:Fortheperiodof10/1/2019through1/10/2020,duetoadatairregularityinthecustomerimpactlists,someindirectsalescustomersmay

nothavereceivedproductchange,productdiscontinuance,orproductbulletinnoticesasexpectedthroughemail.Althoughthesenotificationswere

published on our public portal (https://www.onsemi.com/PowerSolutions/pcnPub.do),ONSemiconductoristakingtheactiontoredistribute

affectednotices,withrevisedimplementationdatesconformingtoexternalstandardsandONSemiconductor’scustomernotificationpolicies.This

issuehasbeenresolved.QuestionsrelatedtothisissuecanbedirectedtoPCN.Support@onsemi.com.

TEM001793 Rev. C Page 1 of 4

TitleofChange:

UpdatetoFPCN22741X‐QualifyASEKSSOIC8LHDLeadframe.

ProposedFirstShipdate:

01Jun2020orearlierifapprovedbycustomer

ContactInformation:

ContactyourlocalONSemiconductorSalesOfficeorMarquita.Jones@onsemi.com

PCNSamplesContact:

ContactyourlocalONSemiconductorSalesOfficeor<PCN.samples@onsemi.com>.

Samplerequestsaretobesubmittednolaterthan30daysfromthedateoffirstnotification,

InitialPCNorFinalPCN,forthischange.

Samplesdeliverytimingwillbesubjecttorequestdate,samplequantityandspecialcustomer

packing/labelrequirements.

AdditionalReliabilityData:

ContactyourlocalONSemiconductorSalesOfficeorChielo.Basa@onsemi.com

TypeofNotification:

ThisisaFinalProduct/ProcessChangeNotification(FPCN)senttocustomers.FPCNsareissued90

dayspriortoimplementationofthechange.

ONSemiconductorwillconsiderthischangeaccepted,unlessaninquiryismadeinwritingwithin

30daysofdeliveryofthisnotice.Todoso,contactPCN.Support@onsemi.com

MarkingofParts/Traceabilityof

Change:

Productmarkedwithdatecode2010(YYWW)orlatermaybebuiltwithcurrentSOIC8Lleadframe

orSOIC8LHDleadframe.ThetracecodemarkingonLine2isoftheformALYWwhereA=

AssemblyLocation,L=WaferLotIDandYWisa2‐digitdatecode.

ChangeCategory:

AssemblyChange

ChangeSub‐Category(s):

MaterialChange,Equipment/Tool

SitesAffected:

ONSemiconductorSites ExternalFoundry/SubconSites

None ASEKS,China

DescriptionandPurpose:





ThisFinalProduct/ProcessChangeNotification(FPCN)announcesthefollowingchangesforSOIC8devicesassembledatASEKunshunforcapacity

enhancement:

 

 BeforeChangeDescription AfterChangeDescription

LeadFrame‐ExposeCu

SOIC8Lleadframe

ExposedCuonleadtiponly



SOIC8LHDleadframe

ExposedCuonshouldersideandleadtip



Leadframe‐Dimension

Device

Dimension(inmils)

NCL30000DR2G 70x73.5

NCP1607BDR2G 70x73.5

NCP1608BDR2G 70x73.5

NCP1611ADR2G 70x73.5

NCP1611BDR2G 70x73.5

Device Dimension(inmils)

NCL30000DR2G 90x90

NCP1607BDR2G 90x90

NCP1608BDR2G 90x90

NCP1611ADR2G 90x90

NCP1611BDR2G 90x90



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