Datasheet 搜索 > 稳压芯片 > ON Semiconductor（安森美） > NCP500SQL30T1G 数据手册 > NCP500SQL30T1G 产品设计图 1/2 页
器件3D模型￥ 1.445
NCP500SQL30T1G 产品设计图 - ON Semiconductor（安森美）
制造商:
ON Semiconductor（安森美）
分类:
稳压芯片
封装:
DFN-6
描述:
LDO) 线性稳压器，150mA，3.0V 至 3.5V，ON Semiconductor### LDO（低压降）线性稳压器，ON Semiconductor低压降或 LDO 为线性稳压器。 我们有多种系列的线性稳压器。 LDO 稳压器可在输入 - 输出差分电压较小时运行。 LDO 稳压器可提供快速瞬态响应、宽输入电压范围、低静态电流、低噪声、高 PSRR。
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NCP500SQL30T1G数据手册
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0.50
0.020
SCALE 10:1
0.40
0.016
1.9
0.075
0.65
0.025
0.65
0.025
0.50
0.020
DFN6 2x2.2 mm
CASE 488−03
ISSUE G
DATE 06 FEB 2006
SCALE 4:1
xxM
xx = Specific Device Code
M = Date Code
GENERIC
MARKING DIAGRAM*
*This information is generic. Please refer
to device data sheet for actual part
marking.
ÍÍÍ
ÍÍÍ
ÍÍÍ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. TERMINAL b MAY HAVE MOLD COMPOUND
MATERIAL ALONG SIDE EDGE.
6. DETAILS A AND B SHOW OPTIONAL VIEWS
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE AND SIDE EDGE OF PACKAGE.
C
A
SEATING
PLANE
D
B
E
0.10 C
A3
A
A1
2X
2X
0.10 C
DIM
A
MIN NOM
MILLIMETERS
0.80 0.90
A1 0.00 0.03
A3 0.20 REF
b 0.20 0.25
D 2.00 BSC
D2 0.40 0.50
0.30 0.35
E
2.20 BSC
b1
e
0.65 BSC
0.30 0.35
L
PIN ONE
REFERENCE
0.08 C
0.10 C
6X
A0.10 C
NOTE 3
e
b1
D2
b
B
3
6
5X
1
L
4
6X
0.05 C
BOTTOM VIEW
MAX
1.00
0.05
0.30
0.60
0.40
0.40
SIDE VIEW
TOP VIEW
A0.10
C
NOTE 3
B
0.05
C
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DETAIL B
DETAIL A
L1
DETAIL A
Bottom View
(Optional)
ÉÉ
ÉÉ
ÉÉ
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
0.00 0.05
L1
0.10
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com
1
© Semiconductor Components Industries, LLC, 2002
October, 2002 − Rev. 0
Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98AON04199D
ON SEMICONDUCTOR STANDARD
DFN6 2 X 2.2 X 0.9 X 0.65P
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
PAGE 1 OF 2
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