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NDS331N
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NDS331N数据手册
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TEM001790 Rev. C Page 1 of 4
Initial Product/Process Change Notification
Document # : IPCN22759X
Issue Date: 8July2019
TitleofChange:
SSOT3(SOT233L)CapacityexpansionofAssemblyandTestoperationsofONCebutoONSeremban,
Malaysia.
ProposedFirstShipdate:
8January2020orearlieraftercustomerapproval
ContactInformation:
ContactyourlocalONSemiconductorSalesOfficeor<Joan.Abigail.Enriquez@onsemi.com>
Samples:
ContactyourlocalONSemiconductorSalesOfficeor<PCN.Samples@onsemi.com>
Samplerequestsaretobesubmittednolaterthan30daysfromthedateoffirstnotification,InitialPCNor
FinalPCN,forthischange.
Samplesdeliverytimingwillbesubjecttorequestdate,samplequantityandspecialcustomer
packing/labelrequirements.
TypeofNotification:
ThisisanInitialProduct/ProcessChangeNotification(IPCN)sent to customers. An IPCN is an advance
notificationaboutanupcomingchangeandcontainsgeneralinformationregardingthechangedetailsand
devicesaffected.Italsocontainsthepreliminaryreliabilityqualificationplan.
ThecompletedqualificationandcharacterizationdatawillbeincludedintheFinalProduct/ProcessChange
Notification(FPCN).ThisIPCNnotificationwillbefollowedbyaFinalProduct/ProcessChangeNotification
(FPCN)atleast90dayspriortoimplementationofthechange.In case of questions, contact
<PCN.Support@onsemi.com>
ChangePartIdentification:
CustomermayreceivethepartsfromONSemiconductorSeremban,MalaysiafrommonthofOct2019
onwardsonceFPCNexpire.PartsfromONSemiconductorSeremban,Malaysiacanbeidentifiedthrough
productmarkingwhichfollowONSemiconductormarkingformat.
ChangeCategory:
WaferFabChange

AssemblyChange TestChange Other
____________
ChangeSub‐Category(s):
ManufacturingSiteAddition
ManufacturingSiteTransfer
ManufacturingProcessChange
MaterialChange
Productspecificchange
Datasheet/ProductDocchange
Shipping/Packaging/Marking
Other:
__________________
SitesAffected:
ONSemiconductorSites:
ONSeremban,Malaysia
ONCebu,Philippines
ExternalFoundry/SubconSites:
None
DescriptionandPurpose:
BeforeChangeDescription AfterChangeDescription
Assembly&Testsite ONCebu,Philippines ONCebu,Philippines ONSeremban,Malaysia
WireType Auwire&Cuwire Cuwire Cuwire
Wiresize 1.5mils&2.0mils 2.0mils 2.0mils
MoldCompound CK5100(PMC) CK5100(PMC) G600FB
Caseoutline 527AG NewCompositeCaseOutline‐TBA(tosupportbothSBNandCebupkgdimensions)
Marking Ex‐Fcsformatmarking Ex‐FCSformatmarking ONFormatmarking

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