Web Analytics
Datasheet 搜索 > MOS管 > Fairchild(飞兆/仙童) > NDS331N 数据手册 > NDS331N 其他数据使用手册 1/8 页
NDS331N
0.475
导航目录
  • 封装尺寸在P1
NDS331N数据手册
Page:
of 8 Go
若手册格式错乱,请下载阅览PDF原文件
Date Created : 2008/02/28
Date Issued On : 2008/04/08
PCN# : Q4074811-A
DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
Updated process quality documentation, such as FMEAs and Control Plans, are available for
viewing upon request.
If you have any questions concerning this change, please contact:
Technical Contact:
Name: Uy, Lester
E-mail: Lester.Uy@fairchildsemi.com
Phone: 63-32-3415636
PCN Originator:
Name: Ursal, Randy
E-mail: Randy.Ursal@notes.fairchildsemi.com
Phone:
Implementation of change:
Expected 1st Device Shipment Date: 2008/05/09
Earliest Year/Work Week of Changed Product: D0819
Change Type Description: Mold Compound
Description of Change (From): SSOT-3 and SSOT-6 package assembly in FSC approved
manufacturing locations using non-Green mold compound as shown in table 1:
Description of Change (To): SSOT-3 and SSOT-6 package assembly at all FSC approved
manufacturing locations using Green mold compound as shown in table 2:
Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is
dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level
interconnect lead-free and RoHS compliance. The referenced material changes have been made
to provide a "Full Green" (Halogen Free Flame Retardant) package. For additional details on the
corporate wide green initiative please visit our Web site at:
http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same
assembly facilities producing the current non-green products. Package outline drawings of the
affected products remain un-changed. Green products will be fully compliant to all published
data sheet specifications and will be interchangeable with current non-green product. Quality
and reliability will remain at the highest standards already demonstrated with Fairchild's
existing products.
Qual/REL Plan Numbers : Q20070473
Qualification :
The qualification for SSOT-3 & SSOT-6 Green EMC passed the Qualification
Requirements as defined in iRel QP Q20070473.
Pg. 1

NDS331N 数据手册

Fairchild(飞兆/仙童)
7 页 / 0.06 MByte
Fairchild(飞兆/仙童)
8 页 / 0.09 MByte
Fairchild(飞兆/仙童)
1 页 / 0.04 MByte
Fairchild(飞兆/仙童)
7 页 / 0.06 MByte
Fairchild(飞兆/仙童)
1 页 / 0.15 MByte

NDS331 数据手册

Fairchild(飞兆/仙童)
N沟道逻辑电平增强模式场效应晶体管 N-Channel Logic Level Enhancement Mode Field Effect Transistor
Fairchild(飞兆/仙童)
FAIRCHILD SEMICONDUCTOR  NDS331N  晶体管, MOSFET, N沟道, 1.3 A, 20 V, 0.11 ohm, 4.5 V, 700 mV
ON Semiconductor(安森美)
ON Semiconductor Si N沟道 MOSFET NDS331N, 1.3 A, Vds=20 V, 3引脚 SOT-23封装
ON Semiconductor(安森美)
Fairchild(飞兆/仙童)
ON Semiconductor(安森美)
Fairchild(飞兆/仙童)
Fairchild(飞兆/仙童)
TI(德州仪器)
器件 Datasheet 文档搜索
器件加载中...
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册,每天更新 5,000 多个 PDF 文件