Datasheet 搜索 > 开发套件与开发板 > Nordic Semiconductor > NRF24LE1-F16Q48-DK 数据手册 > NRF24LE1-F16Q48-DK 产品修订记录 1/4 页

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NRF24LE1-F16Q48-DK 产品修订记录 - Nordic Semiconductor
制造商:
Nordic Semiconductor
分类:
开发套件与开发板
描述:
nRFgo nRF24LE1 开发套件用于 **nRF24LE1** 的 **nRFgo 开发套件**来自 **Nordic Semiconductor**,允许评估和开发 nRF24LE1 2.4GHz RF SoC。 提供三个开发套件 nRF24LE1-F16Q24-DK (QFN24)、nRF24LE1-F16Q32-DK (QFN32) 和 nRF24LE1-F16Q48-DK (QFN48)。 它们均可与 nRFgo 入门套件 (nRF6700) 结合使用,让您可以测试、调试和原型设计 nRF24LE1 片上系统。 所有套件包含三个 nRFgo 兼容无线电模块,软件开发套件 (SDK) CD 以及文档。2 个 nRF24LE1 无线电模块,带印刷电路板天线 1 个 nRF24LE1 无线电模块,带 SMA 连接器,适合与外部天线或闭路设置共用 5 个 nRF24LE1 样本 板载 32kHz 晶体 完整的软件开发套件 (SDK)/文档 与带 Keil μVision 紧密集成 广泛的硬件抽象层 (HAL) 库 射频协议堆栈 **RS 产品代码** 885-5801 QFN24 封装套件 885-5805 QFN32 封装套件 885-5814 QFN48 封装套件 **设备的 RS 产品代码** 885-5757 7 x GPIO QFN24 885-5750 15 x GPIO QFN32 885-5754 31 x GPIO QFN48 ### 单芯片组件,Nordic Semiconductor展开
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NRF24LE1-F16Q48-DK数据手册
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若手册格式错乱,请下载阅览PDF原文件

Informational Notice (IN)
Page 1 of 4
IN no.: IN_114 rev 1.0
Date:
2019-07-11
Device affected: All part numbers starting with nRF
Device version / Build Code: All
Data sheet references:
N/A
Agreement reference:
N/A
Customers reference:
N/A
Description of change:
Standardization of content, lay-out and 2D barcode of the inner box & outer box labels and addition of traceability information
Summary of changes
No.
Inner box label changes
Outer box label changes
1
Introduction of data identifiers (DI)
Introduction of data identifiers
2
Addition of total inner box quantity
Deletion of wafer lot number field
3
Addition of nILN or Nordic internal lot number on the
2D barcode.
Use of 2-letter code for the country of origin instead of
the full country name
4
Logo update
Logo update
5
Standardization of 2D barcode content and sequence
6
Addition of a 2
nd
outer box label combining the 2D
barcodes of all the inner boxes contained on the given
outer box
Impact: Does the change affect product:
1. Form No Yes – describe:
2. Fit No Yes – describe:
3. Function No Yes – describe:
4. Quality or Reliability No Yes – describe:
Classification of change Minor Major
Reason(s) for change:
• Standardized data identifiers (DI’s) introduced for automated parsing of 2D barcodes.
• Additional data identifiers introduced to improve traceability.
• Secondary outer box label added for better data accessibility.
• Other changes were part of over-all label standardization efforts.
Consequences of change:
• Customers employing current 2D barcodes will need to re-configure 2D barcode parsing.
• Relative to current labels, no information is removed, new fields added.
• Stocks with old labels will not be re-labeled. Thus, for a certain period, existence of 2 label formats in one shipment is
possible.
Verification of change:
• These changes have been qualified according to Nordic Semiconductor’s standard QA procedures.
• For current users of 2D barcode, it is recommended to conduct 2D barcode scanning trials on the new labels to ensure smooth
transition to the revised 2D barcode. Sample labels are available upon request.
• For non-users of 2D barcodes, please consider using them for improved traceability.
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