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PCM1804DB
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PCM1804DB数据手册
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Texas Instruments, Inc. PCN# 20150211000B
PCN Number:
20150211000B
PCN Date:
03/30/2015
Title:
Qualification of Carrier Tape for 14/16 pin SOP and 28 pin SSOP device
PCN Manager
Dept:
Quality Services
Proposed 1
st
Ship Date:
06/30/2015
Estimated Sample
Availability:
Date provided at
sample request
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Revision B is to announce (1) addition of new devices that were not included on the original PCN
notification, (2) update carrier tape comparison table in Blue text and (3) remove select devices
in Group 2 of the Product Affected Section (with strikethrough and highlighted in yellow).
Group 1 device: New devices being added to the PCN notification. The expected first shipment
date for these new devices will be 90 days from this notice for these newly added devices only.
Group 2 device: Device being retracted
Group 3 device: Original device list that are impacted on this change
This notification is to inform of TI’s Qualification of change for Carrier Tape 4135168-0070
supporting 14/16 pin SOP and 28 pin SSOP package devices. Carrier tape comparison as follows:
Carrier Tape Comparison:
Reason for Change:
Continuity of Packaging. Tape Side pocket reflection causing high rejection rate on lead
abnormality during Tape and Reel process
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None
Changes to product identification resulting from this PCN:
None
Product Affected Group 1: Additional Devices

PCM1804DB 数据手册

TI(德州仪器)
36 页 / 0.59 MByte
TI(德州仪器)
12 页 / 0.44 MByte
TI(德州仪器)
13 页 / 0.54 MByte
TI(德州仪器)
1 页 / 0.13 MByte

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