Datasheet 搜索 > 编解码器 > TI（德州仪器） > PCM2906CDB 数据手册 > PCM2906CDB 其他数据使用手册 2/30 页
器件3D模型￥ 89.374
PCM2906CDB 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
编解码器
封装:
SSOP-28
描述:
TEXAS INSTRUMENTS PCM2906CDB 音频编解码器, USB接口, 立体声, 2, 2, -25 °C, 85 °C, 48 kSPS
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P6Hot
原理图在P7P8
封装尺寸在P26P27P28
型号编码规则在P2
标记信息在P2
封装信息在P2P26P27P28
技术参数、封装参数在P2
应用领域在P1P25P30
电气规格在P3P4P5
导航目录
PCM2906CDB数据手册
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若手册格式错乱，请下载阅览PDF原文件
PCM2906C
SBFS037 –NOVEMBER 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGING/ORDERING INFORMATION
(1)
SPECIFIED TRANSPORT
PACKAGE TEMPERATURE PACKAGE ORDERING MEDIA,
PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER QUANTITY
PCM2906CDB Rails, 47
PCM2906CDB SSOP-28 DB –25°C to +85°C PCM2906C
Tape and Reel,
PCM2906CDBR
2000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted).
PARAMETER PCM2906C UNIT
Supply voltage, V
BUS
–0.3 to 6.5 V
Ground voltage differences, AGNDC, AGNDP, AGNDX, DGND, DGNDU ±0.1 V
SEL0, SEL1, DIN –0.3 to 6.5
Digital input voltage V
D+, D–, HID0, HID1, HID2, XTI, XTO, DOUT, SSPND –0.3 to (V
DDI
+ 0.3) < 4
V
IN
L, V
IN
R, V
COM
, V
OUT
R, V
OUT
L –0.3 to (V
CCCI
+ 0.3) < 4
Analog input voltage V
V
CCCI
, V
CCP1I
, V
CCP2I
, V
CCXI
, V
DDI
–0.3 to 4
Input current (any pins except supplies) ±10 mA
Ambient temperature under bias –40 to +125 °C
Storage temperature, T
stg
–55 to +150 °C
Junction temperature, T
J
+150 °C
Lead temperature (soldering, 5s) +260 °C
Package temperature (IR reflow, peak) +250 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
PCM2906C
THERMAL METRIC
(1)
DB (SSOP) UNITS
28 PINS
θ
JA
Junction-to-ambient thermal resistance 64.5
θ
JCtop
Junction-to-case (top) thermal resistance 24.5
θ
JB
Junction-to-board thermal resistance 25.4
°C/W
ψ
JT
Junction-to-top characterization parameter 2.0
ψ
JB
Junction-to-board characterization parameter 25.0
θ
JCbot
Junction-to-case (bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): PCM2906C
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