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PIC12C671-04I/P 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
DIP-8
描述:
PIC12C67x 8 位微控制器Microchip 的 PIC12C 系列是 8 位 CMOS 微控制器 (MCU)，在低引脚计数封装中包含了 Microchip 的 PIC® 体系结构。 现在被基于闪存的变体取代，这些 CMOS 设备仍常用于传统设计。 用于新应用，应考虑 PIC12F 变体。 这些 PIC12C67x 微控制器基于 Microchip 的中级内核，包括中断功能、深硬件堆栈和 12 位宽指令。 这些 MCU 提供高达 2.5 个 MIPS、多达 3.5 kb 的程序存储器、多达 128 kb 的数据存储器。 板载 RC 振荡器，精确度为 ±1%。### 特点4 MHz CPU 35 指令 中断功能 八级深硬件堆栈 4 MHz 精密内部 RC 振荡器 五个输入/输出引脚 四个通道，8 位模拟到数字转换器 (ADC) 8 位实时计时器/计数器，带 8 位可编程预定标器 在线串行编程 (ICSP) ### PIC12C Microcontrollers
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PIC12C671-04I/P数据手册
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PRODUCTS APPLICATIONS DESIGN SUPPORT TRAINING SAMPLE AND BUY ABOUT
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Date:
23 Aug 2013
Product Category:
16-bit Microcontrollers and Digital Signal Controllers; Analog (Linear & Mixed Signal) AND
Interface; 8-bit Microcontrollers; RF and Security; Analog (Thermal, Power Management & Safety);
Touch Sensing Technologies
Notification subject:
CCB 1155.05 Initial Notification: Qualification of selected products available in the 28L SPDIP, 8L
PDIP, and 18L PDIP packages with palladium coated copper (PdCu) bond wire at MTAI assembly
site.
Notification text:
PCN Status:
Initial notification
Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
PCN_CYER-09HJXI365_Affected_CPN.xls
PCN_CYER-09HJXI365_Affected_CPN.pdf
Description of Change:
Qualification of selected products available in the 28L SPDIP, 8L PDIP, and 18L PDIP packages with palladium
coated copper (PdCu) bond wire at MTAI assembly site.
NOTE: Selected products are non-automotive standalone analog and PIC MCU devices. Please review the
affected CPN lists (attached) to identify the actual parts affected.
Pre Change:
Gold (Au) wire
Post Change:
Palladium coated copper (PdCu) bond wire
Impacts to Data Sheet:
None
Reason for Change:
To improve manufacturability
Change Implementation Status:
In progress
Estimated First Ship Dates:
October 18, 2013 (Date code: 1342)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
Traceability code
Revision History:
August 23, 2013: Initial notification issue date.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.
Attachment(s):
PCN_CYER-09HJXI365_Affected CPN.pdf
PCN_CYER-09HJXI365_Qual Plan.pdf
PCN_CYER-09HJXI365_Affected CPN.xlsx
Please contact your local Microchip sales officewith questions or concerns regarding this notification.
Terms and Conditions:
Product Change Notification - CYER-09HJXI365 (Printer Friendly)
Page 1 of 2Product Change Notification - CYE
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-09HJXI365 - 23 Aug 2013 - CCB 1155.05 Initial N...
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