Datasheet 搜索 > 8位微控制器 > Microchip（微芯） > PIC12F1572-E/MF 数据手册 > PIC12F1572-E/MF 产品修订记录 1/4 页
器件3D模型￥ 9.458
PIC12F1572-E/MF 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
8位微控制器
封装:
DFN-8
描述:
PIC12F1572-E/MF 管装
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P4
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PIC12F1572-E/MF数据手册
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Page 1 of 3
Product Change Notification / KSRA-13AKNI696
Date:
26-Feb-2021
Product Category:
8-bit Microcontrollers, Capacitive Touch Sensors, Touch Controllers
PCN Type:
Manufacturing Change
Notification Subject:
CCB 4440 Final Notice: Qualification of MMT as an additional assembly site for selected MTCH112,
MTCH810 and PIC12xxxx device families available in 8L DFN (3x3x0.9mm) package.
Affected CPNs:
KSRA-13AKNI696_Affected_CPN_02262021.pdf
KSRA-13AKNI696_Affected_CPN_02262021.csv
Notification Text:
PCN Status:Final notification
PCN Type:Manufacturing Change
Microchip Parts Affected:Please open one of the icons found in the Affected CPNs section.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:Qualification of MMT as an additional assembly site for selected MTCH112, MTCH810 and PIC12xxxx
device families available in 8L DFN (3x3x0.9mm) package.
Pre Change:
Assembled at NSEB using gold (Au) or palladium coated copper wire with gold flash (CuPdAu) bond wire, 8600 die attach
material, EFTEC-64T lead frame or C194 lead frame material, Ag DAP surface prep or Bare Cu DAP surface prep and without
lead lock lead frame
Post Change:
Assembled at NSEB using gold (Au) or palladium coated copper wire with gold flash (CuPdAu) bond wire, 8600 die attach
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