Datasheet 搜索 > 微控制器 > Microchip（微芯） > PIC12F752T-I/MF 数据手册 > PIC12F752T-I/MF 产品修订记录 1/11 页
器件3D模型￥ 8.558
PIC12F752T-I/MF 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
DFN-8
描述:
PIC12F 系列 1.75 KB 闪存 64 B RAM 20 MHz 8位 微控制器 - DFN-8
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P4
导航目录
PIC12F752T-I/MF数据手册
Page:
of 11 Go
若手册格式错乱，请下载阅览PDF原文件
Page 1 of 3
Product Change Notification / LIAL-21DKJL279
Date:
27-Jan-2021
Product Category:
8-bit Microcontrollers, Analog to Digital Converters, Battery Management and Fuel Gauges - Battery
Chargers, Digital Potentiometers, Digital to Analog Converters, Instrumentation Amplifier, Memory,
Power Management - PWM Controllers, Temperature Sensors
PCN Type:
Manufacturing Change
Notification Subject:
CCB 4439.001 and 4439.002 Final Notice: Qualification of MMT as an additional assembly site for
selected products available 8L DFN (3x3x0.9mm) and (2x3x0.9mm) packages.
Affected CPNs:
LIAL-21DKJL279_Affected_CPN_01272021.pdf
LIAL-21DKJL279_Affected_CPN_01272021.csv
Notification Text:
PCN Status:Final notification.
PCN Type: Manufacturing Change
Microchip Parts Affected:Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change: Qualification of MMT as an additional assembly site for selected products available 8L DFN
(3x3x0.9mm and 2x3x0.9mm) packages.
Pre Change:
Assembled at NSEB using gold (Au) bond wire or palladium coated copper with gold flash (CuPdAu) bond wire, 8600 die
attach material, EFTEC-64T lead frame or C194 lead frame material, Ag DAP surface prep or Bare Cu DAP surface prep and
without lead lock lead frame
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