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PIC16C54-RC/P 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
PDIP-18
描述:
PIC16C5x 8 位微控制器Microchip 的 PIC16C 系列微控制器 8 位 CMOS MCU，将 Microchip 的 PIC® 体系架构融入到引脚和封装选件中，从节省空间的 14 引脚设备到功能丰富的 64 引脚设备。 现在由基于闪存的型号代替，这些设备在传统设计方面也仍受到欢迎。 对于新应用，应考虑 PIC16F 型号。 PIC16C5x 系列微控制器基于 Microchip 基线体系结构，带 2 层硬件堆栈和 33 个 12 位指令。 这些 MCU 提供高达 10 MIPS、3 字节程序内存和高达 73 字节 RAM 的数据存储器。 板载是一个 RC 振荡器，精确度为 ±1%。### 特点33 个指令 2 级硬件堆栈 除 PIC16C55/C55A/C57/C57C/CR57C 之外的所有型号上均有 12 个输入/输出引脚 20 个输入/输出引脚 – PIC16C55/C55A/C57/C57C/CR57C 一个 8 位计时器 监控计时器 (WDT) 通电重置 (POR) 设备重置计时器 (DRT)
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P3P59
导航目录
PIC16C54-RC/P数据手册
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Product Change Notification - GBNG-07ROAS851
Date:
13 Apr 2020
Product Category:
Others; 8-bit Microcontrollers; Touch Controllers; 16-Bit - Microcontrollers and Digital Signal
Controllers; Interface- Controller Area Network (CAN); Interface- Infrared Products; Interface- LIN
Transceiver; Interface- Passive-Keyless-Entry Analog Front End; Interface- Serial Peripherals;
Binary and BCD A/D Converters; Display A/D Converters; Linear Comparators; Linear Op Amps;
Linear Programmable Gain Amplifiers; Digital Potentiometers; Dual Slope A/D Converters;
Frequency-to-Voltage / Voltage-to-Frequency Converters; Successive Approximation Register (SAR)
A/D Converters; System D/A Converters; Charge Pump DC-to-DC Converters; Linear Regulators;
Power MOSFET Drivers; Voltage References; Temperature Sensors; Memory; Real-Time
Clock/Calendar; KEELOQ® Decoder Devices; KEELOQ® Encoder Devices; KEELOQ® Transcoder
Devices; USB Bridge; Power Management - PMIC; Power Management - System
Supervisors/Voltage Detectors
Affected CPNs:
Notification subject:
CCB 4203 Final Notice: Qualification of G600V as an additional/alternative mold compound material
for selected products available in 40L, 8L,14L, 16L, 18L, 20L, 28L PDIP and 28L SPDIP packages at
MMT assembly site using palladium coated copper wire with gold flash (CuPdAu) bond wire.
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of G600V as an additional/alternative mold compound material for selected products
available in 40L, 8L,14L, 16L, 18L, 20L, 28L PDIP and 28L SPDIP packages at MMT assembly site
using palladium coated copper wire with gold flash (CuPdAu) bond wire.
Pre Change:
Using GE800 mold compound material.
Post Change:
Using GE800 or G600V mold compound material.
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand (Branch)
(MMT)
Microchip Technology
Thailand (Branch)
(MMT)
Wire material
CuPdAu CuPdAu
Die attach material
CRM-1064L CRM-1064L
Molding compound
material
GE800 GE800 G600V
Lead frame material
CDA194 CDA194
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