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Date:
29 Jun 2016
Product Category:
Analog (Linear & Mixed Signal) AND Interface; 8-bit Microcontrollers
Notification subject:
CCB 1725 Cancellation Notice: For the qualification of 8390A die attach material for products
available 18L SOIC package using palladium coated copper wire (PdCu) bond wire at MTAI
assembly site.
Notification text:
PCN Status:
Cancellation notification
Microchip Parts Affected:
This change would have affected products available 18L SOIC package using palladium coated copper wire
(PdCu) bond wire at MTAI assembly site.
Description of Change:
This qualification was originally performed to qualify 8390A die attach material for products available 18L SOIC
package using palladium coated copper wire (PdCu) bond wire at MTAI assembly site
Impacts to Data Sheet:
Not Applicable
Reason for Change:
Microchip has decided not to qualify 8390A die attach material for products available 18L SOIC package using
palladium coated copper wire (PdCu) bond wire at MTAI assembly site
Change Implementation Status:
Not Applicable
Estimated First Ship Date:
Not Applicable
Markings to Distinguish Revised from Unrevised Devices:
Not Applicable
Revision History:
October 13, 2015: Issued initial notification.
June 29, 2016: Issued cancellation notice for the proposed qualification of 8390A die attach material for products
available 18L SOIC package using palladium coated copper wire (PdCu) bond wire at MTAI assembly site.
Attachment(s):
PCN_JAON-26SYMB368_Affected_CPN.pdf
PCN_JAON-26SYMB368_Affected_CPN.xls
Please contact your local Microchip sales officewith questions or concerns regarding this notification.
Terms and Conditions:
If you wish to change your product/process change notification (PCN) profile please log on to our website at
http://www.microchip.com/PCN sign into myMICROCHIP to open the myMICROCHIP home page, then select a profile option from
the left navigation bar.
To opt out of future offer or information emails (other than product change notification emails), click here to go to microchipDIRECT
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