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PIC16C622A-04I/SO 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
SOIC-18
描述:
PIC16 系列 128 B RAM 2 K x 14位 EPROM 8位 CMOS 微控制器 - SOIC-18
Pictures:
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PIC16C622A-04I/SO数据手册
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若手册格式错乱，请下载阅览PDF原文件
Product Change Notification - KSRA-01ZVUK607
Date:
16 Aug 2018
Product Category:
8-bit Microcontrollers; Development Tools; Touch Controllers; 16-Bit - Microcontrollers and Digital
Signal Controllers; Interface- Controller Area Network (CAN); Interface- Infrared Products; Interface-
Serial Peripherals; Ethernet Controllers
Affected CPNs:
Notification subject:
CCB 3217 and CCB 3217.001 Final Notice: Qualification of palladium coated copper with gold flash
(CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly
site
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products
available in 18L and 28L SOIC package at MTAI assembly site
Pre Change:
Using palladium coated copper wire (PdCu) bond wire
Post Change:
Using palladium coated copper with gold flash (CuPdAu) bond wire
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand
(HQ) / MTAI
Microchip Technology
Thailand
(HQ) / MTAI
Wire material
PdCu Wire CuPdAu Wire
Die attach material
3280 3280
Molding compound
material
G600V G600V
Lead frame material
CDA194 CDA194
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire
Change Implementation Status:
In Progress
Estimated First Ship Date:
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