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器件3D模型￥ 7.033
PIC16C622A-04/SS 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
SSOP-20
描述:
PIC16 系列 128 B RAM 2 K x 14位 EPROM 8位 CMOS 微控制器 - SSOP-20
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
应用领域在P1P3
型号编号列表在P4P5P6P7P8P9P10P11P12P13P14P15
导航目录
PIC16C622A-04/SS数据手册
Page:
of 16 Go
若手册格式错乱，请下载阅览PDF原文件
Englis
h
PRODUCTS APPLICATIONS DESIGN SUPPORT SAMPLE AND BUY ABOUT US CONTACT US MYMICROCHIP LOGIN
more...
Date:
24 Feb 2017
Product Category:
8-bit PIC Microcontrollers; Touch Controllers; Power Management - PWM Controllers; Interface-
Infrared Products; Interface- Serial Peripherals; Energy Measurement; Capacitive Touch Sensors;
16-Bit - Microcontrollers and Digital Signal Controllers; 32-bit PIC Microcontrollers; Piezoelectric
Horn Drivers
Notification subject:
CCB 2818 Final Notice: Qualification of silver (Ag)-on-leads plated lead frame for selected products
available in 20L SSOP package at MTAI assembly site.
Notification text:
PCN Status:
Final notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as
PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of silver (Ag)-on-leads plated lead frame for selected products available in 20L SSOP
package at MTAI assembly site.
Pre Change:
Lead frame with silver (Ag) spot plating
Post Change:
Lead frame with silver (Ag)-on-leads plating
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site MTAI MTAI
Wire material Au wire Au wire
Die attach material 8390A 8390A
Molding compound
material
G600 G600
Lead frame material CDA194 CDA194
Lead Frame Surface Ag spot plating Ag on leads plating
Product Change Notification - JAON-14TQBC849
Page 1 of 3Product Change Notification - JAON-14TQBC849 - 24 Feb 2017 - CCB 2818 Final Notic...
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http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=JAON-14TQBC8
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