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PIC16C770-I/SS 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
SSOP-20
描述:
PIC16 系列 256 B RAM 2 K x 14位 EPROM 8位 CMOS 微控制器 - SSOP-20
Pictures:
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型号编号列表在P3
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PIC16C770-I/SS数据手册
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of 35 Go
若手册格式错乱，请下载阅览PDF原文件
Product Change Notification - KSRA-01FYVO522
Date:
14 Jun 2018
Product Category:
Others; 8-bit PIC Microcontrollers; Touch Controllers; 16-Bit - Microcontrollers and Digital Signal
Controllers; Battery Management and Fuel Gauges- Battery Management Devices (Powersmart);
Interface- Infrared Products; Interface- Serial Peripherals; Wireless Modules; USB Bridge; Capacitive
Touch Sensors; Ethernet Controllers
Affected CPNs:
Notification subject:
CCB 3254 and CCB 3254.001 Final Notice: Qualification of palladium coated copper with gold flash
(CuPdAu) bond wire in selected products available in 20L and 28L SSOP package at MTAI
assembly site
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls)
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products
available in 20L and 28L SSOP package at MTAI assembly site.
Pre Change:
Using palladium coated copper wire (PdCu) bond wire
Post Change:
Using palladium coated copper with gold flash (CuPdAu) bond wire.
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand HQ
(MTAI)
Microchip Technology
Thailand HQ
(MTAI)
Wire material
PdCu CuPdAu
Die attach material
3280 3280
Molding compound
material
G600 G600
Lead frame material
CDA194 CDA194
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
Change Implementation Status:
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