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器件3D模型￥ 3.726
PIC16F1516-I/ML 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
封装:
QFN-28
Pictures:
3D模型
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PIC16F1516-I/ML数据手册
Page:
of 61 Go
若手册格式错乱，请下载阅览PDF原文件
Date:
12 Feb 2018
Product Category:
16-Bit - Microcontrollers and Digital Signal Controllers; Ethernet Controllers; 8-bit PIC Microcontrollers;
Hybrid Controllers; Touch Controllers; Interface- LIN Transceiver; USB Bridge; Interface- Serial
Peripherals; Energy Measurement; Digital Potentiometers; Battery Management and Fuel Gauges -
Battery Chargers; Capacitive Touch Sensors; 32-bit PIC Microcontrollers; Sensor Fusion Hub; USB
Power Delivery
Notification subject:
CCB 3223, 3223.001-3223.007 Initial Notice: Qualification of MMT as an additional assembly site for
selected products available in 44L, 28L QFN-S, 20L,16L and 28L QFN packages.
Notification text:
PCN Status:
Initial notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC,
70nm, SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies available
in 44L, 28L QFN-S, 20L,16L and 28L QFN packages.
Pre Change:
Assembled at MTAI assembly site
Post Change:
Assembled at MTAI or MMT assembly site
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand HQ (MTAI)
Microchip
Technology
Thailand HQ
(MTAI)
Microchip
Technology
Thailand
Branch
(MMT)
Wire material Au Au
Die attach material 3280 3280
Molding compound
material
G700LTD G700LTD
Lead frame material C194 C194
Impacts to Data Sheet:
None
Change Impact:
None
Product Change Notification - LIAL-21URFI599
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2018http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=LIA
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