Datasheet 搜索 > 微控制器 > Microchip（微芯） > PIC16F1519-E/MV 数据手册 > PIC16F1519-E/MV 产品修订记录 2/14 页
器件3D模型￥ 18.688
PIC16F1519-E/MV 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
UQFN-40
描述:
PIC 20MHz 闪存：16K@x14bit
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P4
导航目录
PIC16F1519-E/MV数据手册
Page:
of 14 Go
若手册格式错乱，请下载阅览PDF原文件
Pre and Post Change Summary:
Pre Change
Post Change
Assembly Site
UTAC Thai Limited LTD (NSEB)
UTAC Thai Limited LTD (NSEB)
Microchip
Technology Thailand
(Branch) / MMT
Wire material
Au
Au
Au
Die attach material
8600
8600
8600
Molding compound material
G700LTD
G700LTD
G700LTD
Lead frame material
EFECT 64T
EFECT 64T
EFECT 64T
Impacts to Data Sheet: None
Change Impact:None
Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.
Change Implementation Status:In Progress
Estimated First Ship Date:
August 17, 2020 (date code: 2034)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Time Table Summary:
March 2020
-->
August 2020
Workweek
10
11
12
13
14
31
32
33
34
35
Initial PCN Issue Date
X
Qual Report Availability
X
Final PCN Issue Date
X
Estimated
Implementation Date
X
Method to Identify Change: Traceability code
Qualification Report:Please open the attachments included with this PCN labeled as PCN_#_Qual_Report.
Revision History:March 19, 2020: Issued initial notification.
August 10, 2020: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided
estimated first ship date to be on August 17, 2020.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content
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