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PIC16F1778-I/SP
器件3D模型
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PIC16F1778-I/SP数据手册
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Product Change Notification - GBNG-07ROAS851
Date:
13 Apr 2020
Product Category:
Others; 8-bit Microcontrollers; Touch Controllers; 16-Bit - Microcontrollers and Digital Signal
Controllers; Interface- Controller Area Network (CAN); Interface- Infrared Products; Interface- LIN
Transceiver; Interface- Passive-Keyless-Entry Analog Front End; Interface- Serial Peripherals;
Binary and BCD A/D Converters; Display A/D Converters; Linear Comparators; Linear Op Amps;
Linear Programmable Gain Amplifiers; Digital Potentiometers; Dual Slope A/D Converters;
Frequency-to-Voltage / Voltage-to-Frequency Converters; Successive Approximation Register (SAR)
A/D Converters; System D/A Converters; Charge Pump DC-to-DC Converters; Linear Regulators;
Power MOSFET Drivers; Voltage References; Temperature Sensors; Memory; Real-Time
Clock/Calendar; KEELOQ® Decoder Devices; KEELOQ® Encoder Devices; KEELOQ® Transcoder
Devices; USB Bridge; Power Management - PMIC; Power Management - System
Supervisors/Voltage Detectors
Affected CPNs:
Notification subject:
CCB 4203 Final Notice: Qualification of G600V as an additional/alternative mold compound material
for selected products available in 40L, 8L,14L, 16L, 18L, 20L, 28L PDIP and 28L SPDIP packages at
MMT assembly site using palladium coated copper wire with gold flash (CuPdAu) bond wire.
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of G600V as an additional/alternative mold compound material for selected products
available in 40L, 8L,14L, 16L, 18L, 20L, 28L PDIP and 28L SPDIP packages at MMT assembly site
using palladium coated copper wire with gold flash (CuPdAu) bond wire.
Pre Change:
Using GE800 mold compound material.
Post Change:
Using GE800 or G600V mold compound material.
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand (Branch)
(MMT)
Microchip Technology
Thailand (Branch)
(MMT)
Wire material
CuPdAu CuPdAu
Die attach material
CRM-1064L CRM-1064L
Molding compound
material
GE800 GE800 G600V
Lead frame material
CDA194 CDA194

PIC16F1778-I/SP 数据手册

Microchip(微芯)
610 页 / 5.84 MByte
Microchip(微芯)
38 页 / 0.3 MByte
Microchip(微芯)
16 页 / 0.15 MByte
Microchip(微芯)
120 页 / 0.32 MByte

PIC16F1778 数据手册

Microchip(微芯)
MICROCHIP  PIC16F1778-I/SO  微控制器, 8位, PIC16F17xx, 32 MHz, 28 KB, 2 KB, 28 引脚, SOIC
Microchip(微芯)
PIC16F1773/1776/1777/1778/1779 8 位微控制器PIC16F177x 系列微控制器是基于 Microchip 的增强型中档内核的丰富的外设 MCU,旨在用于各种功能,尤其是 SMPS 应用。 这些设备可连接内部的板载外设,创建闭合回路系统,而无需使用引脚或任何附加印刷电路板区域。### 微控制器功能最大 8 MIPS CPU 速度 增强型中级芯,带 49 说明,16 级堆栈 低电流通电重置 (POR) 可配置通电计时器 (PWRT) 掉电重置 (BOR),带可选触发点 延长监控计时器 (EWDT) 超低功耗 (XLP) 功能 精密内部振荡器 ### 模拟外围设备10 位模拟到数字转换器 (ADC) - 17 到 28 通道,具体取决于型号 运算放大器 – 3 或 4 个,具体取决于型号 高速比较器 – 6 或 8 个,具体取决于型号 数字到模拟转换器 (DAC) – 3 或 4,取决于型号 电压参考 Zero-Cross 探测器 (ZCD) 可编程斜坡发生器 (PRG) – 3 或 4 个,具体取决于型号 两个高电流驱动器输入/输出 - 高达100 mA 灌电流或源电流 (5V) ### 数字外围设备四个可配置逻辑电池 (CLC) - 集成的组合和状态逻辑 互补输出生成器 (COG) – 3 或 4 个,具体取决于型号 捕获/对比/PWM (CCP) 模块 – 3 或 4 个,具体取决于型号 脉冲宽度调制器 (PWM) – 3 或 4 个,具体取决于型号 数据信号调制器 (DSM) – 3 或 4 个,具体取决于型号 外设引脚选择 (PPS) 串行通信 - 增强 (EUSART)、SPI、I2C™、RS-232、RS-485,兼容 LIN
Microchip(微芯)
MICROCHIP  PIC16F1778-I/SP  微控制器, 8位, PIC16F17xx, 32 MHz, 28 KB, 2 KB, 28 引脚, SPDIP
Microchip(微芯)
PIC 32MHz 闪存:16K@x14bit
Microchip(微芯)
Microchip(微芯)
PIC 32MHz 闪存:16K@x14bit
Microchip(微芯)
8位微控制器 -MCU 8-Bit MCU, 28K Flash 2KB RAM, 10b ADC
Microchip(微芯)
PIC 32MHz 闪存:16K@x14bit
Microchip(微芯)
8位微控制器 -MCU 8-Bit MCU, 28K Flash 2KB RAM, 10b ADC
Microchip(微芯)
8位微控制器 -MCU 8-Bit MCU, 28K Flash 2KB RAM, 10b ADC
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