Datasheet 搜索 > 8位微控制器 > Microchip（微芯） > PIC16F1825T-I/SL 数据手册 > PIC16F1825T-I/SL 其他数据使用手册 1/24 页
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PIC16F1825T-I/SL 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
8位微控制器
封装:
SOIC-14
描述:
MICROCHIP PIC16F1825T-I/SL 微控制器, 8位, 闪存, AEC-Q100, PIC16F18xx, 32 MHz, 14 KB, 1 KB, 14 引脚, SOIC
Pictures:
3D模型
符号图
焊盘图
引脚图
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页面导航:
型号编号列表在P3P4P5P6P7P8P9P10P11P12P13P14
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PIC16F1825T-I/SL数据手册
Page:
of 24 Go
若手册格式错乱，请下载阅览PDF原文件
Date:
25 Jan 2018
Product Category:
Linear Op Amps; 8-bit PIC Microcontrollers; Interface- Passive-Keyless-Entry Analog Front End; Touch
Controllers; Interface- Infrared Products; USB Bridge; Interface- Controller Area Network (CAN);
Successive Approximation Register (SAR) A/D Converters; Sigma - Delta A/D Converters; Digital
Potentiometers; System D/A Converters; Linear Comparators; Linear Selectable Gain Amplifiers;
Linear Programmable Gain Amplifiers; Memory; Power MOSFET Drivers; Interface- LIN Transceiver;
Ionization Smoke Detector Front Ends; Piezoelectric Horn Drivers; Charge Pump DC-to-DC Converters
Notification subject:
CCB 3140 and CCB 3140.001 Final Notice: Qualification of palladium coated copper with gold flash
(CuPdAu) bond wire in selected products available in 8L and 14L SOIC package at MTAI assembly
site.
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products
available in 8L and 14L SOIC package at MTAI assembly site.
Pre Change:
Using Palladium coated copper wire (PdCu) bond wire
Post Change:
Using palladium coated copper with gold flash (CuPdAu) bond wire
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand
(HQ) / MTAI
Microchip Technology
Thailand
(HQ) / MTAI
Wire material PdCu Wire CuPdAu Wire
Die attach material 8390A 8390A
Molding compound
material
G600V G600V
Lead frame material CDA194 CDA194
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire
Product Change Notification - KSRA-07LEDG378
Page 1 of 2Product Change Notification - KSR
A
-07LEDG378 - 25 Jan 2018 - CCB 3140 and CCB
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2018http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=KSR
A
-07LEDG
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