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PIC16F18324-I/ST 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
8位微控制器
封装:
TSSOP-14
描述:
PIC 32MHz 闪存：4K@x14bit
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
PIC16F18324-I/ST数据手册
Page:
of 4 Go
若手册格式错乱，请下载阅览PDF原文件
Date:
27 Feb 2018
Product Category:
8-bit PIC Microcontrollers
Notification subject:
CCB 2874 Initial Notice: Qualification of CuPdAu bond wire for selected products of 250K and 290K
wafer technology available in 14L TSSOP package at MMT assembly site
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products of
250K and 290K wafer technology available in 14L TSSOP package at MMT assembly site.
Pre Change:
Assembled using gold (Au) bond wire
Post Change:
Assembled using palladium coated copper with gold flash (CuPdAu) bond wire
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand (MMT)
Microchip Technology
Thailand (MMT)
Wire material Au wire CuPdAu wire
Die attach material 2200D 2200D
Molding compound
material
G600V G600V
Lead frame material C7025 C7025
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire at
MMT assembly site.
Change Implementation Status:
In Progress
Estimated First Ship Date:
March 27, 2018 (date code: 1813)
Product Change Notification - KSRA-23UQZO342
Page 1 of 2Product Change Notification - KSR
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