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PIC16F18325-E/P
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PIC16F18325-E/P数据手册
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Date:
06 Jul 2017
Product Category:
8-bit PIC Microcontrollers
Notification subject:
CCB 2873 and 2873.001-.004 Final Notice: Qualification of CuPdAu bond wire for selected
products of 250K and 290K wafer technology available in 8L,14L, 20L, 40L PDIP and 28L SPDIP
packages at MMT.
Notification text:
PCN Status:
Final notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of CuPdAu bond wire for selected products of 250K and 290K wafer technology available in 8L, 14L,
20L, 40L PDIP and 28L SPDIP packages at MMT assembly site.
Pre Change:
Assembled using gold (Au) bond wire
Post Change:
Assembled using palladium coated copper with gold flash (CuPdAu) bond wire.
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site MMT MMT
Wire material Au CuPdAu
Die attach material CRM-1064L CRM-1064L
Molding compound material GE800 GE800
Lead frame material CDA194 CDA194
Product Change Notification - RMES-15LLWR349
Page 1 of 3Product Change Notification - RME
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