Datasheet 搜索 > 微控制器 > Microchip（微芯） > PIC16F688T-I/ST 数据手册 > PIC16F688T-I/ST 产品描述及参数 2/18 页
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PIC16F688T-I/ST 产品描述及参数 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
TSSOP-14
描述:
MICROCHIP PIC16F688T-I/ST 微控制器, 8位, 闪存, AEC-Q100, PIC16F6xxx, 20 MHz, 7 KB, 256 Byte, 14 引脚, TSSOP
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PIC16F688T-I/ST数据手册
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MPLAB
®
ICE 2000
DS51140N-page 2 © 2007 Microchip Technology Inc.
2.4 Flex Circuit Cable
Once the processor module is inserted into the
emulator pod, the flex circuit cable extends the
emulator system to the target application. This is a
custom cable that is attached inside the processor
module enclosure, and can be replaced in the field by
removing the end cap of the processor module
enclosure.
Please, DO NOT PULL on the flex circuit cable to
remove the processor module from the pod. Use the
fins of the processor module end cap to leverage the
module from the pod.
Emulator analog functions may not operate within the
performance specifications published in the device
data sheet due to parasitic capacitance (up to 120 pf)
of the flex cable.
2.5 Device Adapter
The device adapter provides a common interface for
the device being emulated. It is provided in standard
DIP and PLCC styles. The adapter also contains a spe-
cial device that provides an oscillator clock to accu-
rately emulate the oscillator characteristics of the PIC
MCU.
Due to components on the device adapter, which
require target power, the device adapter should be
removed from the flex circuit cable (see Figure 2-1)
when emulator power is being used and the processor
module is not connected to the target. This will
eliminate any loading effects on I/O pins.
2.6 Transition Socket
Transition Sockets are available in various styles to
allow a common device adapter to be connected to one
of the supported surface mount package styles. Transi-
tion sockets are available for various pin counts and
pitches for SOIC, QFP and other styles. For more infor-
mation on transition sockets, see the “MPLAB
®
ICE
2000/4000 Transition Socket Specification” (DS51194).
An emulator system consists of the following
components which can be ordered separately:
• An emulator pod (including the host-to-pod cable
and power supply)
• A processor module (including the flex circuit
cable)
• A device adapter
• An optional transition socket (for surface mount
emulation)
3.0 EMULATOR-RELATED ISSUES
General limitations that apply to the MPLAB ICE 2000
emulator may be found in the on-line help. Select
Help>Topics and then select “MPLAB ICE 2000” under
“Debuggers”.
Device-specific limitations can be found as above or by
selecting Debugger>Settings
, clicking the Limitations
tab, and then clicking the Details button.
4.0 PROCESSOR MODULES
Processor modules are identified on the top of the
assembly (e.g., PCM18XA0). To determine which
processors are supported by a specific module, refer to
the file “Readme for MPLAB ICE 2000.txt” in the
MPLAB IDE installation directory or the latest “Product
Selector Guide” (DS00148), which can be found on the
Microchip web site at www.microchip.com.
A typical processor module contains a special bond-out
version of a PIC MCU, with device buffers to control
data flow and control logic. It provides the means of
configuring the MPLAB ICE 2000 emulator for a
specific PIC MCU family and handles low-voltage emu-
lation when needed.
4.1 Power
The operating voltage for most of the control logic and
buffering on the processor module is +5V and is
supplied by the emulator pod. Power to the emulator
processor and some of its surrounding buffers is user-
selectable, and can be powered by the emulator pod
(at +5V only) or the target application system (from
2.0V to 5.5V). This is software selectable and is
configurable through the MPLAB IDE software. At no
time will the emulator system directly power the target
application system. ALWAYS insert the processor
module into the emulator pod before applying power to
the pod.
When connecting to a target application system, there
may be a voltage level on the target application even
though power has not yet been applied to the target
application circuit. This is normal, and is due to current
leakage through V
CC of the device adapter. The current
leakage will typically be less than 20 mA. However, if
the target application is using a voltage regulator, it
should be noted that some regulators require the use of
an external shunt diode between VIN and VOUT for
reverse-bias protection. Refer to the manufacturer’s
data sheets for additional information.
Note: When removing the processor module, DO
NOT PULL on the flex cable. Use the tabs
on the processor module or damage to the
flex cable may occur.
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