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PIC16F716-E/SO 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
SOIC-18
描述:
PIC16 系列 128 B RAM 3.5 kB 闪存 8 位 CMOS 微控制器 - SOIC-18
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PIC16F716-E/SO数据手册
Page:
of 28 Go
若手册格式错乱，请下载阅览PDF原文件
Date:
09 Mar 2018
Product Category:
16-Bit - Microcontrollers and Digital Signal Controllers; Ethernet Controllers; Touch Controllers; 8-bit
PIC Microcontrollers; Interface- Serial Peripherals; Interface- Infrared Products; Interface- Controller
Area Network (CAN)
Notification subject:
CCB 3217 and CCB 3217.001 Initial Notice: Qualification of palladium coated copper with gold flash
(CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly
site
Notification text:
PCN Status:
Initial notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products
available in 18L and 28L SOIC package at MTAI assembly site
Pre Change:
Using palladium coated copper wire (PdCu) bond wire
Post Change:
Using palladium coated copper with gold flash (CuPdAu) bond wire
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand
(HQ) / MTAI
Microchip Technology
Thailand
(HQ) / MTAI
Wire material PdCu Wire CuPdAu Wire
Die attach material 3280 3280
Molding compound
material
G600V G600V
Lead frame material CDA194 CDA194
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire
Product Change Notification - KSRA-01ZVUK607
Page 1 of 3Product Change Notification - KSR
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-01ZVUK607 - 09 Mar 2018 - CCB 3217 and CCB ...
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2018http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=KSR
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