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器件3D模型￥ 4.217
PIC16F721-E/ML 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
8位微控制器
封装:
QFN-20
描述:
20引脚闪存单片机采用nanoWatt XLP技术 20-Pin Flash Microcontrollers with nanoWatt XLP Technology
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P4
导航目录
PIC16F721-E/ML数据手册
Page:
of 55 Go
若手册格式错乱，请下载阅览PDF原文件
Product Change Notification - LIAL-21URFI599
Date:
24 May 2018
Product Category:
Digital Potentiometers; Capacitive Touch Sensors; 8-bit PIC Microcontrollers; 16-Bit -
Microcontrollers and Digital Signal Controllers; 32-bit PIC Microcontrollers; Sensor Fusion Hub;
USB Power Delivery; Ethernet Controllers; Hybrid Controllers; Others; Touch Controllers; USB
Bridge; Interface- Serial Peripherals; Energy Measurement
Affected CPNs:
Notification subject:
CCB 3223, 3223.001-3223.007 Final Notice: Qualification of MMT as an additional assembly site
for selected products of 0.25um, 0.18um TSMC, 70nm SMIC, Vanguard,120K,130K, 150K, 160K,
165K, 200K and 290K wafer technologies in 44L, 28 QFN-S, 20L,16L and 28L QFN packages.
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm SMIC,
Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies in 44L, 28 QFN-S, 20L,16L and 28L
QFN packages.
Pre Change:
Assembled at MTAI assembly site
Post Change:
Assembled at MTAI or MMT assembly site
Pre and Post Change Summary:
Impacts to Data Sheet:
None
Change Impact:
None
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand HQ (MTAI)
Microchip Technology
Thailand HQ (MTAI)
Microchip Technology
Thailand Branch (MMT)
Wire material Au Au
Die attach material 3280 3280
Molding compound
material
G700LTD G700LTD
Lead frame material C194 C194
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