Datasheet 搜索 > 微控制器 > Microchip(微芯) > PIC16F723A-E/SO 数据手册 > PIC16F723A-E/SO 产品修订记录 2/5 页


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PIC16F723A-E/SO 产品修订记录 - Microchip(微芯)
制造商:
Microchip(微芯)
分类:
微控制器
封装:
SOIC-28
描述:
28引脚闪存单片机采用nanoWatt XLP技术 28-Pin Flash Microcontrollers with nanoWatt XLP Technology
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P4
导航目录
PIC16F723A-E/SO数据手册
Page:
of 5 Go
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Using QMI-519 die attach material
Pre and Post Change Summary:
Pre Change
Post Change
Assembly Site
Microchip Technology
Thailand
(MTAI)
Microchip Technology
Thailand
(MTAI)
Wire material
CuPdAu
CuPdAu
Die attach material
3280
QMI-519
Molding compound material
G600
G600
Lead frame material
C194
C194
Impacts to Data Sheet: None
Change Impact:None
Reason for Change:To improve productivity by qualifying QMI-519 die attach material
Change Implementation Status:In Progress
Estimated First Ship Date:February 28, 2021 (date code: 2110)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post
change parts.
Time Table Summary:
October 2020
->
February 2021
Workweek
40
41
42
43
44
06
07
08
09
10
Initial PCN Issue
Date
X
Qual Report
Availability
X
Final PCN Issue
Date
X
Estimated
Implementation
Date
X
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