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PIC16F726-E/SS 其他数据使用手册 - Microchip(微芯)
制造商:
Microchip(微芯)
分类:
微控制器
封装:
SSOP-28
描述:
MICROCHIP PIC16F726-E/SS 芯片, 微控制器, 8位, PIC16F, 20MHZ, SSOP-28
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P4P5P6P7P8P9P10P11P12P13P14P15
导航目录
PIC16F726-E/SS数据手册
Page:
of 29 Go
若手册格式错乱,请下载阅览PDF原文件

Date:
14 Jul 2017
Product Category:
8-bit PIC Microcontrollers; 16-Bit - Microcontrollers and Digital Signal Controllers; Ethernet
Controllers; Interface- Serial Peripherals; Interface- Controller Area Network (CAN); Energy
Measurement; Wireless Modules; Capacitive Touch Sensors; 32-bit PIC Microcontrollers
Notification subject:
CCB 3003 Initial Notice: Qualification of MMT as an additional assembly site using gold (Au) bond
wire for selected products available in 28L SSOP package.
Notification text:
PCN Status:
Initial notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as
PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of MMT as an additional assembly site using gold (Au) bond wire for selected
products available in 28L SSOP package.
Pre Change:
Assembled at MTAI or ANAP assembly sites.
Post Change:
Assembled at MTAI or ANAP or MMT assembly sites.
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
MTAI
Assembly
Site
ANAP
Assembly
Site
MTAI
Assembly
Site
ANAP
Assembly
Site
MMT
Assembly
Site
Wire material Au Wire Au Wire Au Wire Au Wire Au Wire
Die attach
material
3280 or
8390A
8290 3280 or
8390A
8290
8390A
Molding
compound
material
G600 G600 G600 G600 G600
Lead frame
material
CDA194 CDA194 CDA194 CDA194 CDA194
Product Change Notification - JAON-10GTAH636
Page 1 of 3Product Change Notification - JAON-10GTAH636 - 14 Jul 2017 - CCB 3003 Initial Not
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