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PRODUCTS APPLICATIONS DESIGN SUPPORT TRAINING SAMPLE AND BUY ABOUT
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Date:
29 Aug 2013
Product Category:
16-bit Microcontrollers and Digital Signal Controllers; Analog (Linear & Mixed Signal) AND
Interface; Touch Sensing Technologies; 8-bit Microcontrollers
Notification subject:
CCB 1155.03 Final Notification: Qualification of selected products available in the 28L SOIC
package with palladium coated copper (PdCu) wire at MTAI assembly site.
Notification text:
PCN Status:
Final notification
Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as
PCN_CYER-27BVXY633_Affected_CPN.xls
PCN_CYER-27BVXY633_Affected_CPN.pdf
Description of Change:
Qualification of selected products available in the 28L SOIC package with palladium coated copper (PdCu) wire at
MTAI assembly site.
NOTE: Selected products are non-automotive standalone analog and PIC MCU devices. Please review the
affected CPN lists (attached below) to identify the actual parts affected.
Pre Change:
Gold (Au) wire
Post Change:
Palladium coated copper (PdCu) wire
Impacts to Data Sheet:
None
Reason for Change:
To improve manufacturability
Change Implementation Status:
Complete
Estimated First Ship Dates:
November 15, 2013 (Date code: 1346)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
Traceability code
Revision History:
August 29, 2013: Final notification issue date.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.
Attachment(s):
PCN_CYER-27BVXY633_Affected CPN.pdf
PCN_CYER-27BVXY633_Qual Report.pdf
PCN_CYER-27BVXY633_Affected CPN.xlsx
Please contact your local Microchip sales officewith questions or concerns regarding this notification.
Terms and Conditions:
If you wish to change your product/process change notification (PCN) profile please log on to our website at
Product Change Notification - CYER-27BVXY633 (Printer Friendly)
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PIC16F73 数据手册

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MICROCHIP  PIC16F73-I/SP  微控制器, 8位, 闪存, PIC16F, 20 MHz, 7 KB, 192 Byte, 28 引脚, NDIP
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PIC16F73/74/76/77 8 位闪存微控制器Microchip 的 PIC16F 系列微控制器 8 位 MCU,将 Microchip 的 PIC® 体系架构融入到引脚和封装选件中,从节省空间的 14 引脚设备到功能丰富的 64 引脚设备。 带有基线、中级或增强型中级体系架构的设备提供多种不同的外围设备组合,可谓设计人员提供灵活性,并为应用提供选择。 PIC16F73/74/76/77 系列微控制器基于 Microchip 的中级内核,带 8 层深硬件堆栈和 35 个指令。 这些 MCU 提供高达 5 个 MIP、14 千字节程序存储器和 368 字节 RAM。### 微控制器功能最大 20 MHz CPU 速度 35 指令 8 级硬件堆栈 22 个输入/输出引脚 – PIC16F73/76 型号 33 个输入/输出引脚 – PIC16F74/77 型号 通电重置 (POR) 通电计时器 (PWRT) 振荡器启动计时器 (OST) 掉电重置 (BOR) 监控器计时器 (WDT) 在线串行编程 (ICSP) 在线调试 (ICD) ### 外设8 位模拟到数字转换器 (ADC) - PIC16F73/76 5 通道、PIC16F74/77 8 通道 两个捕获、比较、PWM (CCP) 模块 两个 8 位计时器 一个 16 位计时器 同步串行端口 (SSP),带有 SPI 和 I2C 通用同步异步接收器发射器 (USART) ### PIC16 微控制器
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MICROCHIP  PIC16F737-I/SP  微控制器, 8位, 闪存, PIC16F, 20 MHz, 7 KB, 368 Byte, 28 引脚, NDIP
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MICROCHIP  PIC16F737-I/SO  微控制器, 8位, 闪存, PIC16F, 20 MHz, 7 KB, 368 Byte, 28 引脚, SOIC
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